HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Short Tlhaloso:

HDI e hatisitsoeng liboto tsa potoloho offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

entsprechen

Le dikarolo: 8

Base Material:FR4 High Tg EM827

Botenya: 1,6 ± 0.10mm

Min.Hole Size：0.15mm

Bonyane Line bophara / Space: 0.10mm / 0.10mm

Phokotso e nyane lipakeng tsa lera la kahare PTH le Line: 0.2mm

Size: 222mm × 120mm

Aspect Ratio：10.6 : 1

Holim kalafo: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Dikopo: Computer

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Product Qaqileng

LBH

Tags sehlahisoa

HDI PCB is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

HDI Board thulaganyou e fana ka tlhahiso:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

Ka kakaretso, tshebetso hlahisa HDI poleiti e rarahaneng, e leng e lokela ho phethoa ka mor'a makhetlo a mangata ea tlhahiso bakeng sa nako e telele. Ha se feela ditlhoko phahameng bakeng sa ho nepahala ha eona le shrinkage taolo ea e mong le lera, empa hape litekanyetso tse phahameng ka ho thepa, lisebelisoa, tikoloho le basebetsi botekgeniki.

YMS HDI PCB manufacturing capabilities:

Kakaretso ea bokhoni ba tlhahiso ea YMS HDI PCB
Tšobotsi	bokhoni
Palo ea Lera	4-60L
Fumaneha HDI PCB Technology	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Lera lefe kapa lefe
Botenya	0.3mm-6mm
Bophara ba mola le Bonyane	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0.35 limilimithara
Mets tham mong bang laser e ile ea fata Size	0.075mm (3nil)
Mets phethahetse Drilled Size	0.15mm (6mil)
Tekanyo ea likarolo tsa lesoba la laser	0.9: 1
Boemo ba tšobotsi bakeng sa lesoba	16: 1
Holim qeta	HASL, E etella pele mahala HASL, ENIG, qoelisoa Tin, OSP, qoelisoa Silver, Gold monoana, Electroplating Hard Khauta, khetla OSP ， ENEPIG.etc.
Ka Khetho ea ho Tlatsa	Tsela e koahetsoe ebe e tlatsoa ka epoxy e tsamaisang kapa e sa tsamaeeng ebe e koaheloa ebe e koahetsoa
	Koporo e tlatsitsoe, silevera e tletse
	Laser ka koporo tlotsitsoe koaloa
Ngoliso	± 4mil
Mask ea solder	Green, Red, Yellow, Blue, White, Black, Pherese, Matte Black, Matte tala.etc.