HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Кӯтоҳ Тавсифи:

Платаҳои микросхемаҳои чопшудаи HDI offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

параметрҳо

Қабатҳои: 8

Base Material:FR4 High Tg EM827

Ғафсӣ: ± 1,6 0.10mm

Min.Hole Size：0.15mm

Хадди Хати Width / Фазои: 0.10mm / 0.10mm

Тозакунии ҳадди аққал байни PTH Layer Inner ва Line: 0.2mm

Ҳаҷм: 222mm × 120mm

Aspect Ratio：10.6 : 1

табобати ои рeизаминb: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Барномаҳо: компютерӣ

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PCI HDI is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

раванди истеҳсолот НРИ Раёсат:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

Дар маҷмӯъ, раванди истењсоли судї рушди инсонї мураккаб аст, ки бояд баъд аз чанд баробар истеҳсолот барои муддати дароз ба анҷом шавад. Ин на танҳо ба Русия ба талаботи баланд барои дақиқӣ ва коҳиш назорати ҳар як қабати, балки меъёрҳои баланди мавод, таҷҳизот, муҳити зист ва кормандони техникї.

YMS HDI PCB manufacturing capabilities:

Бознигарии қобилияти истеҳсолии YMS HDI PCB
Хусусият	имкониятҳо
Ҳисоби қабати	4-60L
Технологияи HDI PCB дастрас	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Ҳар гуна қабат
Ғафсӣ	0.3mm-6mm
Хати минималӣ Васеъ ва Фазо	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0.35мм
Андозаи лазерии минадор	0,075мм (3нил)
Андозаи ҳадди аққали механикӣ	0,15 мм (6 мил)
Таносуби ҷанба барои сӯрохи лазерӣ	0.9: 1
Таносуби ҷанба тавассути сӯрохи	16: 1
Марра рeизаминb	HASL, Lead free HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Ангушти тиллоӣ, Electroplating Gold Gold Hard, Selective OSP ， ENEPIG.etc.
Тавассути опсияи пуркунӣ	Вита андохта мешавад ва бо эпоксиси ноқилӣ ё ноқилӣ пур карда мешавад ва сипас болои он пӯшонида мешавад
	Мис пур, нуқра пур
	Лазерӣ тавассути мис plated хомӯш
Бақайдгирӣ	± 4 мил
Маски Solder	Сабз, сурх, зард, кабуд, сафед, сиёҳ, арғувон, матои сиёҳ, сабз сабз. Ва ғайра.