HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Luv hauj lwm:

HDI luam tawm Circuit Boards offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

tsis

Khaubncaws sab nraud povtseg: 8

Base Material:FR4 High Tg EM827

Thickness: 1.6 ± 0.10mm

Min.Hole Size：0.15mm

Yam tsawg kawg nkaus Kab Dav / Space: 0.10mm / 0.10mm

Kev Tawm Tsam Tsawg Kom Nruab Nrab ntawm Txheej Txheej PTH thiab Kab ： 0.2mm

Loj: 222mm × hli 120

Aspect Ratio：10.6 : 1

Deg kev kho mob: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Daim ntaub ntawv: Computer

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Cov FAQ

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HDI PCB is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

HDI Board lawm txheej txheem:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

Nyob rau hauv tag nrho, lub ntau lawm txheej txheem ntawm HDI phaj yog complex, uas yuav tsum tau ua kom tiav tom qab ntau lub sij hawm ntawm ntau lawm rau ib tug ntev lub sij hawm. Nws yog tsis tsuas muaj yuav tsum tau rau cov neeg thiab shrinkage tswj ntawm txhua txheej, tab sis kuj coj kev cai nyob rau hauv cov ntaub ntawv, cov khoom, ib puag ncig thiab kev cov neeg ua.

YMS HDI PCB manufacturing capabilities:

YMS HDI PCB kev tsim khoom muaj peev xwm txheej txheem cej luam
Ntseg	muaj peev xwm
Txheej Txheej	4-60L
Muaj HDI PCB Tshuab	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Txhua txheej
Thickness	0.3mm-6mm
Yam tsawg kawg kab Dav thiab qhov chaw	0.05mm / 0.05mm (2mil / 2mil)
BGA CHAW	0.35 hli
Min laser Drilled Qhov loj me	0.075mm (3nil)
Min mechanical Drilled Qhov Coob	0.15 hli (6mil)
Aspect Piv rau laser lub qhov	0.9: 1
Saib tus ntsuas rau ntawm lub qhov	16: 1
Nto xaus	HASL, Lead dawb HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Kub, Xaiv OSP ， ENEPIG.etc.
Ntawm Cov Kev Xaiv Sau	Qhov ntawm yog plated thiab muaj nrog cov conductive lossis tsis-conductive epoxy ces capped thiab plated dua
	Tooj liab ntim, tau sau nyiaj
	Laser ntawm tooj liab plated kaw
Sau npe	4mil
Tus Neeg Muag Khoom Daim npog qhov ncauj	Ntsuab, Liab, Daj, Xiav, Dawb, Dub, Ntshav, Matte Dub, Matte green.etc.