HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Breve descrizione:

Circuiti stampati HDI offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

parametri

Strati: 8

Base Material:FR4 High Tg EM827

Spessore: 1,6 ± 0,10 millimetri

Min.Hole Size：0.15mm

Spessore linea minima / Spazio: 0,10 millimetri / 0,10 millimetri

Gioco minimo tra lo strato interno PTH e la linea ： 0,2 mm

Dimensioni: 222 millimetri × 120 millimetri

Aspect Ratio：10.6 : 1

Trattamento di superficie: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Applicazioni: Computer

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Dettagli del prodotto

FAQ

Tag dei prodotti

PCB HDI is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

HDI Consiglio processo di produzione:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

Nel complesso, il processo di produzione del piatto HDI è complessa, che deve essere completata dopo molte volte di produzione per un lungo tempo. È non solo elevati requisiti per la precisione e restringimento controllo di ogni strato, ma anche elevati standard di materiali, attrezzature, ambiente e personale tecnico.

YMS HDI PCB manufacturing capabilities:

Panoramica delle capacità di produzione di PCB YMS HDI
Caratteristica	capacità
Conteggio strati	4-60L
Tecnologia PCB HDI disponibile	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Qualsiasi strato
Spessore	0,3 mm-6 mm
Larghezza e spazio minimo della linea	0,05 mm / 0,05 mm (2mil / 2mil)
PASSO BGA	0,35 mm
Dimensione min forata laser	0,075 mm (3 a zero)
Dimensione minima forata meccanica	0,15 mm (6 mil)
Proporzioni per foro laser	0.9: 1
Rapporto d'aspetto per foro passante	16: 1
Finitura superficiale	HASL, HASL senza piombo, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Galvanotecnica Hard Gold, OSP selettivo ， ENEPIG.etc.
Tramite l'opzione di riempimento	Il via è placcato e riempito con resina epossidica conduttiva o non conduttiva, quindi ricoperto e placcato
	Riempito di rame, riempito d'argento
	Laser via rame placcato chiuso
Registrazione	± 4mil
Maschera per saldatura	Verde, rosso, giallo, blu, bianco, nero, viola, nero opaco, green.etc opaco.