China HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB factory and manufacturers | Yongmingsheng
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HDI printed circuit boards 8Layer 2 Step HDI Board| YMS PCB

Kort beskrywing:

HDI gedrukte stroombaanborde offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

Grense

Lae: 8

Base Material:FR4 High Tg EM827

Dikte: 1.6 ± 0.10mm

Min.Hole Size:0.15mm

Minimum Line breedte / Space: 0.10mm / 0.10mm

Minimum opruiming tussen binnelaag PTH en lyn : 0,2 mm

Grootte: 222mm x 120mm

Aspect Ratio:10.6 : 1

Oppervlak behandeling: ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Aansoeke: Rekenaar


produk Detail

Vrae

produk Tags

HDI PCB is the high-density interconnector PCB. It is a type of PCB technology that is very popular in various devices. HDI PCBs are the results of miniaturization of components and semiconductor packages because they can realize more functions on the same or less board area through some technologies.

HDI PCBs have finer lines, minor holes, and higher density than conventional PCBs, providing necessary touting solutions for the chips with many pins in mobile devices and other high-tech products.HDI PCB usually has 4,6,8 layer or even higher.

HDI design combines dense component placement and finer circuits, using less board without compromise functions. Compared to ordinary PCBs, the main difference is that HDI PCBs realize the interconnect through blind vias and buried vias instead of through holes. And HDI PCBs use laser drilling while traditional PCBs usually use mechanical drilling. The birth of the HDI PCBs brings more possibilities for portable electronic devices and more challenges for PCB manufacturers. For accommodating the trend of miniaturization and multifunction of electronics, YMS has done a lot to improve the level of equipment and staff professionalism. You can be assured to offer us the HDI designs, and we will give you a satisfactory service and HDI products.

HDI raad produksie proses:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

In die geheel gesien, die produksie proses van HDI plaat is kompleks, wat moet na baie keer van produksie vir 'n lang tyd om te voltooi. Dit is nie net 'n hoë vereistes vir die akkuraatheid en krimp beheer van elke laag, maar ook 'n hoë standaarde in materiaal, toerusting, omgewing en tegniese personeel.

HDI PCB

YMS HDI PCB manufacturing capabilities:

YMS HDI PCB vervaardigingsmoontlikhede oorsig
Funksie vermoëns
Laagtelling 4-60L
Beskikbaar HDI PCB-tegnologie 1 + N + 1
2 + N + 2
3 + N + 3
4 + N + 4
5 + N + 5
Enige laag
Dikte 0,3 mm-6 mm
Minimum lynbreedte en spasie 0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH 0,35 mm
Min laser geboorde grootte 0,075 mm (3nul)
Min meganiese geboorde grootte 0.15mm (6mil)
Beeldverhouding vir lasergat 0,9: 1
Beeldverhouding vir deurgat 16: 1
Oppervlak afwerking HASL, loodvrye HASL, ENIG, onderdompeltin, OSP, onderdompelingsilwer, goue vinger, galvanisering hardgoud, selektiewe OSP , ENEPIG.etc.
Via vulopsie Die via is oorgetrek en gevul met geleidende of nie-geleidende epoksie, dan bedek en oorgetrek
Koper gevul, silwer gevul
Laser via koper oorgetrek
Registrasie ± 4mil
Soldeermasker Groen, Rooi, Geel, Blou, Wit, Swart, Pers, Mat Swart, Matgroen. Ens.


https://www.ymspcb.com/8-layer-2-step-hdi-board-yms-pcb.html



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  • What is HDI material?

    FR4 Fiberglass board or ceramic board

    Are printed circuit boards still used?

    Yes,the Printed circuit board(PCB) is the foundation of electronic equipment, and it can be found in every electronic device in today ’s world

    What is the major disadvantage of printed circuit boards?

    1.single use 2.environmental pollution 3.high cost

    Is there gold in printed circuit boards?

    yes,there is

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