Any layer hdi pcb 12Layer Staggered Vias Immersion Gold| YMS PCB

Kout Deskripsyon:

HDI any-layer printed circuit boards,sometimes also called an ELIC – Every Layer Interconnect HDI, is a PCB where each layer is a microvia-based HDI layer, and all the connections between the layers are made using copper filled microvias.

paramèt

Kouch: 12L HDI nenpòt ki kouch pkb

Komisyon Konsèy Thinkness: 1.6mm

Base Material:FR4 High Tg S1170

Twou Min: 0.2mm

Minimòm Liy Lajè / Clearance ： 0.075mm / 0.075mm

Clearance Minimòm ant Inner Kouch PTH ak Liy ： 0.2mm

Size：981mm×65mm

Aspè Pwopòsyon: 10: 1

tretman sifas: Enig

Speciality: Any layer hdi pcb, Laser via copper plated shut

Diferans enpedans 100 + 7 / -8Ω

Aplikasyon: Kominikasyon

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What is HDI PCB?

HDI pkb: High density interconnect PCB, are a way of making more room on your printed circuit board to make them more efficient and allow for faster transmission. It's relatively easy for most enterprising companies that are using printed circuit boards to see how this can benefit them.

Avantaj nan PCB HDI

Rezon ki pi komen pou itilize teknoloji HDI se yon ogmantasyon siyifikatif nan dansite anbalaj. Espas la jwenn nan estrikti tras sibtilite ki disponib pou konpozan. Anplis, kondisyon espas jeneral yo redwi sa pral lakòz nan pi piti gwosè tablo ak mwens kouch.

Anjeneral FPGA oswa BGA ki disponib ak 1mm oswa mwens espas. Teknoloji HDI fè routage ak koneksyon fasil, sitou lè routage ant broch.

YMS HDI PCB fabrikasyon kapasite kapasite:

YMS HDI PCB fabrikasyon kapasite BECA
Karakteristik	kapasite
Kouch Konte	4-60L
Disponib HDI PCB Teknoloji	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Nenpòt kouch
Epesè	0.3mm-6mm
Minimòm liy lajè ak espas	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0.35mm
Min lazè komanse fouye gwosè	0.075mm (3nil)
Min mekanik gwosè komanse fouye	0.15mm (6mil)
Aspè Pwopòsyon pou twou lazè	0.9: 1
Aspè Pwopòsyon pou nan twou	16: 1
Sifas Fini	HASL, plon gratis HASL, ENIG, eten imèsyon, OSP, ajan imèsyon, dwèt lò, galvanoplastie difisil lò, selektif OSP ， ENEPIG.etc.
Via Ranpli Opsyon	Via a se plake ak plen ak swa konduktif oswa ki pa kondiktif epoksidik Lè sa a, capped ak plake sou
	Kuiv plen, ajan plen
	Lazè atravè kwiv plake fèmen
Enskripsyon	± 4mil
Mask soude	Vèt, Wouj, Jòn, Blue, Blan, Nwa, Koulè wouj violèt, Matte Nwa, Matte green.etc.