Any layer hdi pcb 12Layer Staggered Vias Immersion Gold| YMS PCB

Koarte beskriuwing:

HDI any-layer printed circuit boards,sometimes also called an ELIC – Every Layer Interconnect HDI, is a PCB where each layer is a microvia-based HDI layer, and all the connections between the layers are made using copper filled microvias.

parameters

Lagen: 12L HDI pcb mei alle lagen

Board Thinkness: 1,6 mm

Base Material:FR4 High Tg S1170

Min gatten: 0,2 mm

Minimale rigelbreedte / klaring ： 0,075 mm / 0,075 mm

Minimale ôfstân tusken binnenlaach PTH en line ： 0.2mm

Size：981mm×65mm

Aspektferhâlding ： 10: 1

Oerflak treatment: enig

Speciality: Any layer hdi pcb, Laser via copper plated shut

Differinsjele impedânsje 100 + 7 / -8Ω

Applications: Communication

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What is HDI PCB?

HDI PCB: High density interconnect PCB, are a way of making more room on your printed circuit board to make them more efficient and allow for faster transmission. It's relatively easy for most enterprising companies that are using printed circuit boards to see how this can benefit them.

Foardielen fan HDI PCB

De meast foarkommende reden foar it brûken fan HDI-technology is in wichtige tanimming fan ferpakkingsdichtheid. De romte dy't wurdt ferkrigen troch finere spoarstrukturen is beskikber foar komponinten. Trouwens, algemiene romteeasken wurde fermindere sille resultearje yn lytsere boerdmjittingen en minder lagen.

Meastentiids binne FPGA as BGA te krijen mei ôfstân fan 1 mm. HDI-technology makket routing en ferbining maklik, fral by routing tusken pins.

YMS HDI PCB-produksjekapasiteit :

YMS HDI PCB produksje mooglikheden oersjoch
Eigenskip	mooglikheden
Laach telle	4-60L
Beskikbere HDI PCB Technology	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Eltse laach
Dikte	0,3 mm-6 mm
Minimale rigelbreedte en romte	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0.35 mm
Min laser boarre Grutte	0,075mm (3nul)
Min meganyske boarre Grutte	0,15 mm (6mil)
Aspektferhâlding foar lasergat	0.9: 1
Aspektferhâlding foar trochgeand gat	16: 1
Oerflakte ôfwurking	HASL, Lead free HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP ， ENEPIG.etc.
Fia Folje-opsje	De fia wurdt pleatst en fol mei geleidend as net-geleidend epoksy, dan ôfsluten en oerplakt
	Koper fol, sulver fol
	Laser fia koper plated ticht
Ynskriuwing	± 4mil
Solder Masker	Grien, read, giel, blau, wyt, swart, pears, mat swart, mat grien. Ensfh.