| technyske index | Massa partij | lytse batch | Foarbyld | ||
| basismateriaal | FR4 | normaal Tg | Shengyi S1141, KB6160, Huazhen H140 (net geskikt foar lead frije proses) | ||
| Midden Tg | Foar HDI, multi lagen: SY S1000H, ITEQIT158, HuazhengH150; TU-662; | ||||
| Heech Tg | Foar dikke Copper, hege laach: SY S1000-2; ITEQIT180A; HuazhengH170; ISOLA: FR408R; 370HR; TU-752; | ||||
| Halogeenfrij | Middle Tg: SY S1150G, HuazhengH150HF, H160HF; hege Tg: SY S1165 | ||||
| Hege CTI | CTI≥600 SY S1600, Huazheng H1600HF, H1600A; | ||||
| Hege frekwinsje | Rogers, Arlon, Taconic, SY SCGA-500, S7136; HuazhengH5000 | ||||
| Hege snelheid | SY S7439; TU-862HF, TU-872SLK; ISOLA: I-Speed, ik-Tera @ MT40; Huazheng: H175, H180, H380 | ||||
| Flexmateriaal | Basis | Glue-frij: Dupont AK XingyangW-type, Panosonic RF-775; | |||
| Coverlay | SY SF305C, Xingyang Q-type | ||||
| Spesjale PP | Gjin flow PP: VT-447LF, Taiguang 370BL Arlon 49N | ||||
| Ceramic filled adhesive sheet: Rogers4450F | |||||
| PTFE adhesive sheet: Arlon6700, Taconic FR-27 / FR-28 | |||||
| Double-sided coatingPI: xingyang N-1010TF-mb | |||||
| Metalen basis | Berguist Al-basis, Huazheng Al-basis, chaosun Al-basis, copperbase | ||||
| Spesjaal | Hege waarmte resistance rigidity PI: Tenghui VT-901, Arlon 85n, SY S260 (Tg250) | ||||
| Hege termyske conductivity materiaal: 92ML | |||||
| Pure keramiek materiaal: alumina keramiek, Aluminium nitride keramyk | |||||
| BT materiaal: Taiwan Nanya NGP-200WT | |||||
| lagen | FR4 | 36 | 60 | 140 | |
| Stive & Flex / (Flex) | 16 （6） | 16 （6） | 24 （6） | ||
| Hege Frequency Mixed Lamination | 12 | 12 | 20 | ||
| 100% PTFE | 6 | 6 | 10 | ||
| HDI | 2 stappen | 3 stappen | 4 stappen | ||
| technyske Index | Massa partij | lytse Batch | Foarbyld | ||
| levering Grutte | Max (mm) | 460 * 560 | 460 * 560 | 550 * 900 | |
| (Mm) | Min (mm) | 20 * 20 | 10 * 10 | 5 * 10 | |
| Breedte / Gap | Ynderlike (mil) | 0.5OZ base Koper: 3/3 1.0OZ base Koper: 4/4 2.0OZ base Koper: 5/6 | |||
| 3.0OZ base Koper: 7/9 4.0OZ base Koper: 8/12 5.0OZ base Koper: 10/15 | |||||
| 6.0OZ base Koper: 12/18 10 OZ basis Koper: 18/24 12 OZ basis Koper: 20/28 | |||||
| Outer (mil) | 1 / 3OZ base Copper: 3/3 0.5OZ base Koper: 4/4 1.0OZ base Koper: 5/5 | ||||
| 2.0OZ base Koper: 6/8 3.0OZ base Koper: 7/10 4.0OZ base Koper: 8/13 | |||||
| 5.0OZ base Koper: 10/16 6.0OZ base Koper: 12/18 10 OZ basis Koper: 18/24 | |||||
| 12 OZ base Koper: 20/28 15 OZ basis Koper: 24/32 | |||||
| Line Breedte Tolerânsje | > 5.0 mil | ± 20% | ± 20% | ± 1.0mil | |
| ≤5,0 mil | ± 1.0mil | ± 1.0mil | ± 1.0mil | ||
| boarring | Min laser (mm) | 0.1 | 0.1 | 0.1 | |
| Min CNC (mm) | 0.2 | 0.15 | 0.15 | ||
| Max CNC drill bit (mm) | 6.5 | 6.5 | 6.5 | ||
| Min Half Hole (mm) | 0.5 | 0.4 | 0.4 | ||
| PTH gat (mm) | Normaal | ± 0.1 | ± 0,075 | ± 0,075 | |
| Druk sette Hole | ± 0,05 | ± 0,05 | ± 0,05 | ||
| Hole Angle (koanyske) | Breedte fan boppeste diameter≤6.5mm: 800,900,1000,1100; breedte fan boppeste diameter≥6.5mm: 900; | ||||
| Strangens fan Djipte-control Drilling (mm) | ± 0.10 | ± 0,075 | ± 0,05 | ||
| Oantal bline CNC gatten fan ien kant | ≤2 | ≤3 | ≤4 | ||
| Minimum fia gat spacing (ferskillende netwurk, militêre, medysk, Automobile) mm | 0.5 | 0,45 | 0.4 | ||
| Minimum fia gat spacing (ferskillende netwurk, algemien industrial kontrôle en konsumint elektroanyske) mm | 0.4 | 0.35 | 0.3 | ||
| technyske index | Massapartij | lytse batch | foarbyld | ||
| boarring | De minimale gat muorre spacing fan de mear as gat (deselde netwurk mm) | 0.2 | 0.2 | 0.15 | |
| Minimum gat muorre spacing (mm) foar apparaat gatten | 0.8 | 0.7 | 0.7 | ||
| De minimale ôfstân fan fia gat nei it binnenste koper of line | 0.2 | 0,18 | ≤10L: 0,15 | ||
| > 10L: 0,18 | |||||
| De min ôfstân fan Device gat nei ynderlike koper of line | 0.3 | 0.27 | 0.25 | ||
| welding Ring | via gat | 4 (HDI 3mil) | 3.5 (HDI 3mil) | 3 | |
| (Mil) | komponint gat | 8 | 6 | 6 | |
| Solder Dam (mil) | (Solder mask) | 5 | 4 | 4 | |
| (Hybride) | 6 | 5 | 5 | ||
| Finale Board Thickness | > 1.0 mm | ± 10% | ± 8% | ± 8% | |
| ≤1,0 mm | ± 0.1mm | ± 0.1mm | ± 0.1mm | ||
| Board dikte (mm) | 0.5-5.0 | 0.4-6.5 | 0.3-11.5 | ||
| Board dikte / drill bit | 10:01:00 | 12:01:00 | 13:01:00 | ||
| Fia gat (drill bits) plug gat (plug solder) | 0,25-0,5mm | 0,20-0,5mm | 0,15-0,6mm | ||
| Bline begroeven gat, gat binnen pad | 0,25-0,5mm | 0,20-0,5mm | 0.10-0.6mm | ||
| Bôge en twist | ≤0,75% | ≤0,75% | ≤0,5% | ||
| Impedanz Control | ≥5.0mil | ± 10% | ± 10% | ± 8% | |
| <5.0mil | ± 10% | ± 10% | ± 10% | ||
| CNC | contour ferdraachsumens (mm) | ± 0.15 | ± 0.10 | ± 0.10 | |
| V-CUT Tolerânsje fan wat immen noch dikte (mm) | ± 0.15 | ± 0.10 | ± 0.10 | ||
| Routing slot (mm) | ± 0.15 | ± 0.10 | ± 0.10 | ||
| Strangens fan behearske djippe Konsolfräsmaschinen (mm) | ± 0.15 | ± 0.10 | ± 0.10 | ||
| technyske index | Massapartij | lytse batch | foarbyld | ||
| contour | bevel edge | 20 ~ 60 graad; ± 5degree | |||
| surface Treatments | immersion gold | Ni dikte (mikro inch) | 118-236 | 118-236 | 118-236 |
| Maks goud (uinch) | 3 | 3 | 6 | ||
| Hard goud (Au thick) | Gold finger (uinch) | 15 | 30 | 60 | |
| NiPdAu | NI (uinch) | 118-236 | |||
| PA (uinch) | 2-5 | ||||
| Au (uinch) | 1-5 | ||||
| Graph elektryske gold | NI (uinch) | 120-400 | |||
| AU (uinch) | 1-3 | ||||
| immersion tin | Tin (um) | 0.8-1.2 | |||
| Streektaal Ag | Ag (uinch) | 6-10 | |||
| OSP | thick (um) | 0.2-0.5 | |||
| HAL / HAL LF | BGApad (mm) | ≥0.3 × 0.3 | |||
| dikte (mm) | 0.6≤H≤3.0 | ||||
| Board dikte vs gat diameter | Druk op hole≤3: 1 | ||||
| Tin (um) | 2.0-40.0 | ||||
| Stiif & Flex | Maksimum dielectric dikte fan flex | Glue Zwolle 25um | Lijmfrij 75um | Lijmfrij75um | |
| Flex part breedte (mm) | ≥10 | ≥5 | ≥5 | ||
| Max levering grutte (mm) | 200 × 400 | 200 × 500 | 400 × 550 | ||
| ôfstân of fia gat te râne fan stive & flex (mm) | ≥1.2 | ≥1.0 | ≥0,8 | ||
| (Mm) ôfstân fan komponinten gat oan 'e râne fan R & M | ≥1,5 | ≥1.2 | ≥1.0 | ||
| technyske index | Massapartij | lytse batch | foarbyld | ||
| Stiif & Flex | Struktuer | De bûtenste laach struktuer fan 'e flex diel, de PI fersterking struktuer en de ôfskieding struktuer | Aluminium basearre strakke flex, stive flex HDI, kombinaasje, elektromagnetyske shielding film | ||
| Spesjale Tech | Back drilling PCB, metalen sandwich, dikke koper begroeven blyn gat, stap Slot, disc gat, heal gat, mingd lamination | Begroeven magnetic kearn PCB | Begroeven capacitor / wjerstannen, ynbêde koper yn in part gebiet, 100% keramische PCB, begroeven riveting moer PCB, ynbêde komponinten PCB | ||
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