ʻO ka PCB kumu nui, ʻike ʻia no ko lākou hiki ke hāʻawi i ka dissipation thermal pono no nā huahana uila), ʻo ia ka ʻano maʻamau - ʻo ka mea kumu me ka Metal kumu me FR4 maʻamau. Hōʻike ia i kahi papa ʻaila wela e hoʻopau i ka wela i kahi ʻano kūpono, ʻoiai e ʻoluʻolu nā mea a hoʻonui i ka hana holoʻokoʻa o nā huahana. I kēia manawa, ʻike ʻia nā PCB Back Metal e like me ka hopena i ka mana kiʻekiʻe a me nā noi hoʻomanawanui paʻa.
Ma o ka noiʻi lōʻihi a me ke aʻo ʻana, a ua hōʻiliʻili ʻia he mau makahiki o ka ʻike, ua haku mākou i ka ʻenehana kiʻekiʻe o Metal PCB.
1.Multi laminating aluminika-ma muli PCBs / Soldering ʻenehana i ke kākoʻo ʻana i nā PCB e hoʻokō i nā pono o ka wela maikaʻi e pā pono ana i nā PCB multi-layer;
2.Buried ʻenehana mākia nui no nā PCB i hoʻokumu ʻia me ka hao me nā lamineka metala i waenakonu e hiki ai i ka wela e ʻā a me ka hoʻohui liʻiliʻi liʻiliʻi.
3. ʻO ke ʻenehana o ke keleawe kanu kanu hapa ʻia e hoʻokō i nā pono o ka mālama kālā ʻana, hoʻohui liʻiliʻi liʻiliʻi a me nā uila kiʻekiʻe;
4. ʻO ka hiki i ka hoʻolālā ʻana o nā pōʻai concentric i loko o nā PCB kumu hao e hiki ai ke hoʻokaʻawale ma waena o nā puka hoʻopaʻa a me nā puka PTH i kēlā mau PCB;
5. ʻO ka ʻenehana hana i hoʻohui ʻia i nā PCB kumu hao e hōʻoiaʻiʻo i ka hilinaʻi kiʻekiʻe ma waena o nā kumu hao a me nā epoxy resin a me nā laminate hydrocarbon.
