HDI pcb so layer hdi pcb maualuga televave faʻaofiina leiloa leiloa suʻega enepig | YMSPCB

Faamatalaga puupuu:

HDI any-layer printed circuit boards,sometimes also called an ELIC – Every Layer Interconnect HDI, is a PCB where each layer is a microvia-based HDI layer, and all the connections between the layers are made using copper filled microvias.

le faataamilosaga

Faʻaputuga: 12L HDI soʻo-vaega pcb

Mafaufauga a le Komiti: 1.6mm

Faavae Mea: M7NE

Min Lone: 0.2mm

Lautele aupito lautele laina / kilia: 0.075mm / 0.075mm

Maualalo kilia i le va Totonu Totonu PTH ma Line ： 0.2mm

Tele ： 107.61mm × 123.45mm

Vaega Fuafuaina: 10: 1

Luga togafitiga: ENEPIG + Auro lima

Faʻapitoa: Soʻo se vaega hb pcb, maualuga televave mea, plating auro faigata mo pito fesoʻotaʻiga, faʻaofiina leiloa leiloa, Z-au milling, leisa ala apamemea plated tapunia

Faagasologa Faapitoa: mafiafia o tamatamai lima Gold: 12 "

Faʻafitauli eseʻese 100 + 7 / -8Ω

Talosaga: Optical module

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Faamatalaga oloa

FAQ

pine o oloa

O le a le HDI PCB

HDI PCB: High density interconnect PCB, are a way of making more room on your printed circuit board to make them more efficient and allow for faster transmission. It's relatively easy for most enterprising companies that are using printed circuit boards to see how this can benefit them.

Lelei o HDI PCB

O le mafuaʻaga sili ona taatele mo le faʻaaogaina o tekonolosi HDI o se faʻateleina o le faʻateleina o le afifiina. O le avanoa maua e finer ala fausaga o avanoa mo vaega. E le gata i lea, o le aotelega avanoa manaʻoga e faʻaititia o le a mafua ai le laʻititi laupapa lapopoʻa ma laʻititi laʻasaga.

E masani lava e avanoa le FPGA poʻo le BGA ma le 1mm pe laʻititi foʻi le avanoa. HDI tekonolosi faʻafaigofie fegasoloaʻi ma fesoʻotaʻiga, aemaise pe a faʻasolosolo i le va o pine.

YMS HDI PCB gaosiga capa faʻamalosia :

YMS HDI PCB gaosiga gafatia aotelega
Faʻaaliga	agavaʻa
Faʻamaumauga	4-60L
Avanoa HDI PCB Tekonolosi	1 + N + 1
	2 + N + 2
	3 + N + 3
	4 + N + 4
	5 + N + 5
	Soʻo se vaega
Mafiafia	0.3mm-6mm
Maualalo laina lautele ma avanoa	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0.35mm
Min leisa Viliina tele	0.075mm (3nil)
Min masini Viliina lapoa	0.15mm (6mil)
Vaega Fua Faʻatusatusa mo leisa pu	0.9: 1
Aspect Fua faʻatusatusa mo ala pu	16: 1
Luga Faʻamaeʻaina	HASL, Lead free HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Filifili OSP, ENEPIG.etc.
Via Faatumu Filifiliga	O le ala e ufiufi ma faʻatumuina i le epoxy conductive poʻo le non-conductive ona faʻapipiʻi lea ma ufiufi i luga
	Ua tumu le kopa, ua tumu le ario
	Leisa e ala i apamemea plated tapunia
Lesitalaina	± 4milā
Ufimata ufimata	Lanumeamata, Mumu, Lanumoana, Lanumoana, Paʻepaʻe, Uliuli, lanu viole, Matte Uliuli, Matte lanumeamata.