Multi-Layer or Multilayer Print
Led Circuit Boards (PCBs), or Multilayer Boards (MLBs), which have more than 2 copper layers. A multilayer PCB must have a minimum of 3 conductive layers of conductive material or copper layer. All the layers are interconnected with copper plated holes, including NC vias and laser microvias either in plated through, or in buried and blind.Layers of copper foil, prepreg (PP) or adhesive, and core materials are sandwiched together under high temperature and pressure to produce multilayer PCB boards. Pressure is needed to squeeze out air while heat is required to melt and cure the thermosetting PP or adhesive which holds the multilayer PCB together.Multilayer PCBs are built by joining all the number of layers and materials at high temperature and pressure so as to remove any trapped air between the layers. Resin and adhesive material is used to stick the components and different layers together. You can choose from a number of materials such as exotic ceramic, epoxy glass, or Teflon etc. to build your PCB. The different prepreg and core layers are combined and go through the lamination process taking place at high temperature and pressure that helps to melt the layers together. After that the PCB is cooled down to form a hard and solid board. As a multi-layer PCB manufacturer,YMS PCB makes high quality PCBs for our customers. The advantage of using a multi-layer board is the designer can use multiple layers for all the traces they require to connect their components on the board. This helps to realize a complicated circuit for a small product such as a mobile phone or a pocket recorder.
A multilayer PCB also increases the flexibility of a designer to better control single-ended and differential impedance, including improving the signal integrity for high frequencies.
Most manufacturers of electronic products use multilayer PCBs as they offer high design flexibility, stability, and reliable device performance. Multilayer PCBs allow them to use large-scale integrated circuits, and they can have products with high precision, high density, and high levels of digitization.
