Hlau tub ntxhais PCB, paub txog lawv lub peev xwm los muab kev ua kom zoo thermal dissipation rau cov khoom siv hluav taws xob), yog hom ntau tshaj plaws - cov khoom siv dag zog muaj cov hlau core nrog tus qauv FR4. Nws nta thermal clad txheej uas dissipates tshav kub nyob rau hauv tus yam ntxwv siv tau zoo, thaum ua kom txias thiab ua kom txhua yam kev ua tau zoo ntawm cov khoom. Tam sim no, Hlau Backed PCBs tau suav hais tias yog kev daws teeb meem rau lub zog loj thiab kev ua kom lub siab tawv.
Los ntawm kev tshawb nrhiav ntev thiab kev kawm, thiab kev paub ntau xyoo, peb ua cov thev naus laus zis thev naus laus zis siab ntawm Hlau PCB.
1.Multi laminating aluminium-based PCBs / Soldering thev naus laus zis kom koom nrog cov PCBs ua kom tiav cov kev xav tau zoo tshaj los ntawm kev ua kom muaj cua sov rau ntawm ntau txheej PCBs;
2.Buried sib nqus cov tub ntxhais thev naus laus zis rau cov hlau ua PCBs nrog cov hlau laminates hauv nruab nrab ua kom muaj cua sov ua kom muaj cua sov thiab tseem muaj kev sib txuam me me;
3.Qhov thev naus laus zis ntawm qee qhov faus tooj ua kom tiav cov kev xav tau ntawm kev txuag tus nqi, qhov loj me me kev sib xyaw ua ke thiab siab tawg;
4.Qhov tsim muaj peev xwm ntawm cov sib txawv ntawm cov voj voog hauv cov hlau puag PCBs ua rau muaj qhov sib cais ntawm kev kho qhov thiab PTH qhov hauv cov PCBs;
5.Cov kev sib xyaw ua ke tshuab hauv cov hlau puag PCBs ua kom muaj kev cia siab ntawm cov hlau puag thiab epoxy resin lossis hydrocarbon laminates.
