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Properties of aluminum pcb | YMS

Yongmingsheng technology aluminum pcb manufacturers take you to understand the performance of aluminum pcb.

Aluminum pcb, a kind of raw material, is a kind of metal pcb copper clad plate with good heat dissipation function.It is a sheet material made of electronic fiberglass cloth or other reinforced materials dipped in resin, single resin and other insulating adhesive layer, one or both sides covered with copper foil and made by hot pressing. It is called copper clad foil laminated aluminum pcb, referred to as aluminum based copper clad plate.

Properties of aluminum pcb

1.excellent heat dissipation performance

Aluminum base copper clad foil has excellent heat dissipation performance, which is the most outstanding characteristic of this kind of plate.The PCB made with it can not only effectively prevent the working temperature of the components and pcb loaded on it from rising, but also quickly emit the heat generated by the power amplifier components, high-power components and large circuit power switches.

In addition, because of its small density, light weight (2.7g/cm³), anti-oxidation, the price is cheaper, so it has become the most widely used metal-based copper cladding plate, the amount of a composite plate.Insulated aluminum pcb saturated thermal resistance is 1.10℃/W, thermal resistance is 2.8℃/W, which greatly improves the copper wire fuse current.

2.improve the efficiency and quality of machining

Aluminum base copper clad plate has high mechanical strength and toughness, which is much better than the rigid resin type copper clad plate and ceramic pcb.It can realize the manufacture of large area of printed board on metal pcb, especially suitable for mounting heavy components on such pcb.

In addition, the aluminum pcb also has good flatness.It can be used for hammering, riveting and other assembly processing on the pcb or bending and twisting along the non-wiring part of the PCB made from it.But the traditional resin type copper-clad plate cannot.

3.High dimensional stability

Thermal expansion (dimensional stability) is a problem for all kinds of copper clad plates, especially the thermal expansion in the thickness direction of the plate (Z axis), which affects the quality of metallization holes and circuits.The main reason is that the linear expansion coefficient of the plate is different, such as copper, and the linear expansion coefficient of epoxy glass fiber cloth pcb is 3.

The linear expansion difference between the two is very large, which can easily lead to the difference in the thermal expansion of the pcb, resulting in the fracture or destruction of copper wires and metallization holes.The linear expansion coefficient of aluminum pcb is between, it is much smaller than the general resin pcb.Therefore, it is closer to the linear expansion coefficient of copper, which is beneficial to ensure the quality and reliability of the printed circuit.

So that's the performance of the aluminum pcb.Yongmingsheng is a professional supplier of aluminum pcb.Hope this article must you help, welcome everyone to consult.

Image information aluminum pcb:


Post time: Jan-19-2021
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