| Technical Fanondroana | Mass Batch | Andiany kely | Sample | ||
| Fitaovana fototra | FR4 | Normal TG | Shengyi S1141, KB6160, Huazhen H140 (tsy mety ho dingana firaka maimaim-poana) | ||
| Middle TG | Fa HDI, maro sosona: SY S1000H, ITEQIT158, HuazhengH150; TU-662; | ||||
| High TG | Fa matevina varahina, avo sosona: SY S1000-2; ITEQIT180A; HuazhengH170, Isola: FR408R; 370HR, TU-752; | ||||
| Halogen Free | Afovoany TG: SY S1150G, HuazhengH150HF, H160HF, avo TG: SY S1165 | ||||
| CTI avo | CTI≥600 SY S1600, Huazheng H1600HF, H1600A; | ||||
| Fahita matetika | Rogers, Arlon, Taconic, SY SCGA-500, S7136; HuazhengH5000 | ||||
| Haingam-pandeha | SY S7439, TU-862HF, TU-872SLK, Isola: I-Speed, I-Tera @ MT40, Huazheng: H175, H180, H380 | ||||
| Flex Material | Base | Lakaoly-maimaim-poana: Dupont AK XingyangW-karazana, Panosonic RF-775; | |||
| Coverlay | SY SF305C, Xingyang Q-karazana | ||||
| PP manokana | No mikoriana PP: VT-447LF, Taiguang 370BL Arlon 49N | ||||
| Ceramic feno adhesive taratasy: Rogers4450F | |||||
| PTFE adhesive taratasy: Arlon6700, Taconic FR-27 / FR-28 | |||||
| Double-misy rindrina coatingPI: xingyang N-1010TF-MB | |||||
| Base Metal | Berguist Al-tena ratsy, Huazheng Al-tena ratsy, chaosun Al-tena ratsy, copperbase | ||||
| Teknika manokana | Hentitra loatra hafanana avo fanoherana Pi: Tenghui VT-901, Arlon 85N, SY S260 (Tg250) | ||||
| Conductivity fitaovana avo mafana: 92ML | |||||
| Pure tanimanga ara-nofo: alumina tanimanga, Aluminium nitride seramika | |||||
| Bt ara-nofo: Taiwan Nanya NGP-200WT | |||||
| sosona | FR4 | 36 | 60 | 140 | |
| Henjana & Flex / (Flex) | 16 (6) | 16 (6) | 24 (6) | ||
| Frequency mifangaro avo Lamination | 12 | 12 | 20 | ||
| PTFE 100% | 6 | 6 | 10 | ||
| HDI | 2 dingana | 3 dingana | 4 dingana | ||
| Fanondroana teknika | Mass Batch | Batch kely | Sample | ||
| Haben'ny fandefasana | Max (MG) | 460 * 560 | 460 * 560 | 550 * 900 | |
| (Mm) | Min (MG) | 20 * 20 | 10 * 10 | 5 * 10 | |
| Sakany / Gap | Inner (Mil) | 0.5OZ base varahina: 3/3 1.0OZ base varahina: 4/4 2.0OZ base varahina: 5/6 | |||
| 3.0OZ base varahina: 7/9 4.0OZ base varahina: 8/12 5.0OZ base varahina: 10/15 | |||||
| 6.0OZ base varahina: 12/18 10 OZ fototra varahina: 18/24 12 OZ fototra varahina: 20/28 | |||||
| Ivelany (Mil) | 1 / 3OZ base varahina: 3/3 0.5OZ base varahina: 4/4 1.0OZ base varahina: 5/5 | ||||
| 2.0OZ base varahina: 6/8 3.0OZ base varahina: 7/10 4.0OZ base varahina: 8/13 | |||||
| 5.0OZ base varahina: 10/16 6.0OZ base varahina: 12/18 10 OZ fototra varahina: 18/24 | |||||
| 12 OZ base varahina: 20/28 15 OZ fototra varahina: 24/32 | |||||
| -Dalana, Width Tolerance | > 5.0 Mil | ± 20% | ± 20% | ± 1.0mil | |
| ≤5.0 Mil | ± 1.0mil | ± 1.0mil | ± 1.0mil | ||
| ary atsofony | Min tamin'ny laser (MG) | 0.1 | 0.1 | 0.1 | |
| Min CNC (MG) | 0,2 | 0,15 | 0,15 | ||
| Max kely CNC fandavahana (MG) | 6.5 | 6.5 | 6.5 | ||
| Min Half Hole (MG) | 0,5 | 0,4 | 0,4 | ||
| PTH Hole (MG) | ara-dalàna | ± 0.1 | ± 0,075 | ± 0,075 | |
| maika Hole | ± 0,05 | ± 0,05 | ± 0,05 | ||
| Hole Angle (bongo) | Sakan'ny ambony diameter≤6.5mm: 800,900,1000,1100; sakan'ny ambony diameter≥6.5mm: 900; | ||||
| Fametrahana mazava tsara ny Lalina-fanaraha-maso ary atsofony (MG) | ± 0.10 | ± 0,075 | ± 0,05 | ||
| Isan'ny jamba CNC lavaka ny lafiny iray | ≤2 | ≤3 | ≤4 | ||
| Minimum alalan'ny lavaka Heba (tambajotra hafa, ara-tafika, ara-pitsaboana, fiara) MG | 0,5 | 0,45 | 0,4 | ||
| Minimum alalan'ny lavaka Heba (tambajotra hafa, fanaraha-maso ankapobeny sy ny mpanjifa indostria elektronika) MG | 0,4 | 0,35 | 0.3 | ||
| Technical Fanondroana | Andiam-be | Andiany kely | santionany | ||
| ary atsofony | Ny rindrina lavaka ambany indrindra Heba 'ny ny lavaka (izany tambajotra mm) | 0,2 | 0,2 | 0,15 | |
| Minimum lavaka rindrina Heba (mm) ny fitaovana lavaka | 0,8 | 0,7 | 0,7 | ||
| Ny elanelana kely indrindra amin'ny alalan'ny lavaka ho varahina ny anatiny na ny tsipika | 0,2 | 0,18 | ≤10L: 0,15 | ||
| > 10L: 0,18 | |||||
| Ny min Distance from Device anaty lavaka ho varahina na ny tsipika | 0.3 | 0,27 | 0.25 | ||
| Peratra vy | Via lavaka | 4 (HDI 3mil) | 3.5 (HDI 3mil) | 3 | |
| (Mil) | singa fototra lavaka | 8 | 6 | 6 | |
| Solder Dam (Mil) | (Solder saron-tava) | 5 | 4 | 4 | |
| (Mifangaro) | 6 | 5 | 5 | ||
| Final Board hateviny | > 1.0 MG | ± 10% | ± 8% | ± 8% | |
| ≤1.0 MG | ± 0.1mm | ± 0.1mm | ± 0.1mm | ||
| Board hateviny (MG) | 0.5-5.0 | 0.4-6.5 | 0.3-11.5 | ||
| Board hateviny / fanazaran kely | 10:01:00 | 12:01:00 | 13:01:00 | ||
| Via lavaka (fandavahana bit)-tsipiriany lavaka (plug solder) | 0.25-0.5mm | 0.20-0.5mm | 0.15-0.6mm | ||
| Jamba nalevina lavaka, lavaka ao anaty pad | 0.25-0.5mm | 0.20-0.5mm | 0.10-0.6mm | ||
| Tsipìka sy manolan- | ≤0.75% | ≤0.75% | ≤0.5% | ||
| Fanaraha-maso Impedance | ≥5.0mil | ± 10% | ± 10% | ± 8% | |
| <5.0mil | ± 10% | ± 10% | ± 10% | ||
| CNC | contour fandeferana (MG) | ± 0,15 | ± 0.10 | ± 0.10 | |
| V-NANAPAKA residual Tolerance ny hateviny (MG) | ± 0,15 | ± 0.10 | ± 0.10 | ||
| Tambazotra slot (MG) | ± 0,15 | ± 0.10 | ± 0.10 | ||
| Fametrahana mazava tsara ny maso lalina mihaohao (MG) | ± 0,15 | ± 0.10 | ± 0.10 | ||
| Technical Fanondroana | Andiam-be | Andiany kely | santionany | ||
| Contour | Bevel sisin'ny | 20 ~ 60 mari-pahaizana, ± 5degree | |||
| surface Treatments | asitrika volamena | Ni hateviny (bitika santimetatra) | 118-236 | 118-236 | 118-236 |
| Max volamena (uinch) | 3 | 3 | 6 | ||
| Hard volamena (Au matevina) | Gold rantsan-(uinch) | 15 | 30 | 60 | |
| NiPdAu | NI (uinch) | 118-236 | |||
| PA (uinch) | 2-5 | ||||
| Au (uinch) | 1-5 | ||||
| Graph herinaratra volamena | NI (uinch) | 120-400 | |||
| AU (uinch) | 1-3 | ||||
| asitrika firapotsy | Tin (à) | 0.8-1.2 | |||
| asitrika Ag | Ag (uinch) | 6-10 | |||
| OSP | matevina (à) | 0.2-0.5 | |||
| Hal / Hal LF | BGApad (MG) | 0.3 × ≥0.3 | |||
| hateviny (MG) | 0.6≤H≤3.0 | ||||
| Board hateviny vs lavaka savaivony | Press hole≤3: 1 | ||||
| Tin (à) | 2.0-40.0 | ||||
| Henjana & Flex | Maximum dielectric sakan'ny Flex | Lakaoly -free 25um | Lakaoly-maimaim-poana 75um | Lakaoly-free75um | |
| Flex anjara sakany (MG) | ≥10 | ≥5 | ≥5 | ||
| Max fanaterana habeny (MG) | 200 × 400 | 200 × 500 | 400 × 550 | ||
| halavirana ny alalan'ny lavaka ny lelan-mihetsika & Flex (MG) | ≥1.2 | ≥1.0 | ≥0.8 | ||
| (Mm) halavirana ny singa lavaka ho any an-tsisin'ny R & F | ≥1.5 | ≥1.2 | ≥1.0 | ||
| Technical Fanondroana | Andiam-be | Andiany kely | santionany | ||
| Henjana & Flex | FIRAFITRA | Ny sosona ivelany firafitry ny Flex ampahany, ny Pi fanamafisana rafitra sy ny fisarahana rafitra | Aluminum monina henjana Flex, henjana Flex HDI, mitambatra, herinaratra miaro sarimihetsika | ||
| Teknolojia manokana | Back ary atsofony PCB, sandwich vy, varahina matevina nalevina jamba lavaka, dingana slot, kapila lavaka, antsasaky ny lavaka, mifangaro lamination | Niara-nalevina andriamby fototra PCB | Niara-nalevina capacitor / resistor, nandinika lalina amin'ny ampahany varahina faritra, 100% tanimanga PCB, nalevina riveting bazana PCB, nandinika lalina singa PCB | ||
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