| indéks teknis | angkatan massa | angkatan leutik | conto | ||
| base Bahan | FR4 | normal Tg | Shengyi S1141, KB6160, Huazhen H140 (teu cocok keur prosés bébas lead) | ||
| Tg tengah | Pikeun IPM, multi lapisan: sy S1000H, ITEQIT158, HuazhengH150; TU-662; | ||||
| tinggi Tg | Pikeun tambaga kandel, lapisan luhur: sy S1000-2; ITEQIT180A; HuazhengH170; Isola: FR408R; 370HR; TU-752; | ||||
| halogén Free | Tengah Tg: sy S1150G, HuazhengH150HF, H160HF; Tg tinggi: sy S1165 | ||||
| tinggi CTI | CTI≥600 sy S1600, Huazheng H1600HF, H1600A; | ||||
| Frékuénsi tinggi | Saduy, Arlon, Taconic, sy SCGA-500, S7136; HuazhengH5000 | ||||
| Gancang | Sy S7439; TU-862HF, TU-872SLK; Isola: I-Speed, abdi-tera @ MT40; Huazheng: H175, H180, H380 | ||||
| Flex Bahan | dasar | Lem-gratis: Dupont AK XingyangW-jenis, Panosonic RF-775; | |||
| Coverlay | Sy SF305C, Xingyang Q-tipe | ||||
| PP husus | Taya aliran PP: VT-447LF, Taiguang 370BL Arlon 49N | ||||
| Keramik dieusi lambaran napel: Rogers4450F | |||||
| PTFE napel lambar: Arlon6700, Taconic FR-27 / FR-28 | |||||
| Dua kali sided coatingPI: xingyang N-1010TF-MB | |||||
| metal Base | Berguist Al-basa, Huazheng Al-basa, chaosun Al-basa, copperbase | ||||
| istimewa | panas tinggi lalawanan rigidity pi: Tenghui VT-901, Arlon 85N, sy S260 (Tg250) | ||||
| Luhur bahan konduktivitas termal: 92ML | |||||
| bahan keramik murni: keramik alumina, Aluminium nitride keramik | |||||
| bahan BT: Taiwan Nanya NGP-200WT | |||||
| lapisan | FR4 | 36 | 60 | 140 | |
| Kaku & Flex / (Flex) | 16 （6） | 16 （6） | 24 （6） | ||
| Tinggi Frékuénsi campuran Lamination | 12 | 12 | 20 | ||
| 100% PTFE | 6 | 6 | 10 | ||
| IPM | 2 lengkah | 3 lengkah | 4 léngkah | ||
| Index teknis | angkatan massa | angkatan leutik | conto | ||
| Ukuran pangiriman | Max (mm) | 460 * 560 | 460 * 560 | 550 * 900 | |
| (Mm) | Min (mm) | 20 * 20 | 10 * 10 | 5 * 10 | |
| Lebar / Gap | Batin (Mil) | 0.5OZ base tambaga: 3/3 1.0OZ base tambaga: 4/4 2.0OZ base tambaga: 5/6 | |||
| 3.0OZ base tambaga: 7/9 4.0OZ base tambaga: 8/12 5.0OZ base tambaga: 10/15 | |||||
| 6.0OZ base tambaga: 12/18 10 oz base tambaga: 18/24 12 oz base tambaga: 20/28 | |||||
| Luar (Mil) | 1 / 3OZ base tambaga: 3/3 0.5OZ base tambaga: 4/4 1.0OZ base tambaga: 5/5 | ||||
| 2.0OZ base tambaga: 6/8 3.0OZ base tambaga: 7/10 4.0OZ base tambaga: 8/13 | |||||
| 5.0OZ base tambaga: 10/16 6.0OZ base tambaga: 12/18 10 oz base tambaga: 18/24 | |||||
| 12 oz base tambaga: 20/28 15 oz base tambaga: 24/32 | |||||
| Garis Width kasabaran | > 5.0 Mil | ± 20% | ± 20% | 1.0mil ± | |
| ≤5.0 Mil | 1.0mil ± | 1.0mil ± | 1.0mil ± | ||
| pangeboran | Mnt laser (mm) | 0,1 | 0,1 | 0,1 | |
| Mnt CNC (mm) | 0,2 | 0,15 | 0,15 | ||
| bor bit Max CNC (mm) | 6.5 | 6.5 | 6.5 | ||
| Mnt Satengah Hole (mm) | 0,5 | 0,4 | 0,4 | ||
| Mean ka-p Hole (mm) | biasa | ± 0,1 | ± 0,075 | ± 0,075 | |
| Hole mencet | ± 0.05 | ± 0.05 | ± 0.05 | ||
| Liang Angle (kerucut) | Rubak diameter≤6.5mm luhur: 800,900,1000,1100; rubak diameter≥6.5mm luhur: 900; | ||||
| Precision of Jerona-control pangeboran (mm) | ± 0,10 | ± 0,075 | ± 0.05 | ||
| Jumlah CNC liang buta tina hiji sisi | ≤2 | ≤3 | ≤4 | ||
| Minimum via dipasing liang (jaringan béda, militer, médis, mobil) mm | 0,5 | 0,45 | 0,4 | ||
| Minimum via dipasing liang (jaringan béda, kontrol industri umum tur éléktronik konsumen) mm | 0,4 | 0,35 | 0,3 | ||
| indéks teknis | angkatan massa | angkatan leutik | conto | ||
| pangeboran | Minimum dipasing témbok liang nu leuwih liang (jaringan sami mm) | 0,2 | 0,2 | 0,15 | |
| témbok liang minimum dipasing (mm) pikeun liang alat | 0,8 | 0,7 | 0,7 | ||
| Minimum jarak ti via liang ka tambaga jero atawa garis | 0,2 | 0,18 | ≤10L: 0,15 | ||
| > 10L: 0,18 | |||||
| The mnt jarak ti liang Alat keur tambaga jero atawa garis | 0,3 | 0,27 | 0,25 | ||
| las Ring | via liang | 4 (IPM 3mil) | 3,5 (IPM 3mil) | 3 | |
| (Mil) | liang komponén | 8 | 6 | 6 | |
| Solder Dam (Mil) | (Solder topeng) | 5 | 4 | 4 | |
| (Sato) | 6 | 5 | 5 | ||
| Final Board ketebalan | > 1.0 mm | ± 10% | ± 8% | ± 8% | |
| ≤1,0 mm | ± 0.1mm | ± 0.1mm | ± 0.1mm | ||
| ketebalan dewan (mm) | 0,5-5,0 | 0.4-6.5 | 0.3-11.5 | ||
| ketebalan dewan / bor bit | 10:01:00 | 12:01:00 | 13:01:00 | ||
| Via liang (bor bit) nyolok liang (colokan solder) | 0.25-0.5mm | 0.20-0.5mm | 0.15-0.6mm | ||
| liang dikubur buta, liang jero Pad | 0.25-0.5mm | 0.20-0.5mm | 0.10-0.6mm | ||
| Ruku jeung pulas | ≤0,75% | ≤0,75% | ≤0,5% | ||
| impedansi Control | ≥5.0mil | ± 10% | ± 10% | ± 8% | |
| <5.0mil | ± 10% | ± 10% | ± 10% | ||
| CNC | kasabaran kontur (mm) | ± 0,15 | ± 0,10 | ± 0,10 | |
| V-motong kasabaran of ketebalan residual (mm) | ± 0,15 | ± 0,10 | ± 0,10 | ||
| slot Routing (mm) | ± 0,15 | ± 0,10 | ± 0,10 | ||
| Precision of dikawasa panggilingan jero (mm) | ± 0,15 | ± 0,10 | ± 0,10 | ||
| indéks teknis | angkatan massa | angkatan leutik | conto | ||
| garis nu ngurilingan wangun | ujung Bevel | 20 ~ 60 gelar; ± 5degree | |||
| perlakuan permukaan | immersion emas | ketebalan ni (mikro inci) | 118-236 | 118-236 | 118-236 |
| Max emas (uinch) | 3 | 3 | 6 | ||
| Teuas emas (Au kandel) | ramo emas (uinch) | 15 | 30 | 60 | |
| NiPdAu | Ni (uinch) | 118-236 | |||
| Pa (uinch) | 2-5 | ||||
| Au (uinch) | 1-5 | ||||
| Grafik emas listrik | Ni (uinch) | 120-400 | |||
| AU (uinch) | 1-3 | ||||
| immersion tin | Tin (um) | 0.8-1.2 | |||
| immersion Ag | Ag (uinch) | 6-10 | |||
| OSP | kandel (um) | 0,2-0,5 | |||
| Hal / Hal LF | BGApad (mm) | ≥0.3 × 0,3 | |||
| ketebalan (mm) | 0.6≤H≤3.0 | ||||
| ketebalan dewan vs diameter liang | Pencét hole≤3: 1 | ||||
| Tin (um) | 2.0-40.0 | ||||
| Kaku & Flex | ketebalan diéléktrik maksimum flex | Lem -free 25um | 75um lem-gratis | Lem-free75um | |
| bagian lebar Flex (mm) | ≥10 | ≥5 | ≥5 | ||
| Ukuran pangiriman Max (mm) | 200 × 400 | 200 × 500 | 400 × 550 | ||
| jarak via liang pikeun tepi tina kaku & flex (mm) | ≥1.2 | ≥1.0 | ≥0.8 | ||
| (Mm) jarak komponén liang tepi R & F | ≥1.5 | ≥1.2 | ≥1.0 | ||
| indéks teknis | angkatan massa | angkatan leutik | conto | ||
| Kaku & Flex | struktur | Struktur luar lapisan sahiji bagian flex, struktur tulangan pi jeung struktur separation | Aluminium dumasar flex kaku, heuras flex IPM, kombinasi, éléktromagnétik shielding pilem | ||
| tech husus | Deui pangeboran PCB, sandwich logam, kandel tambaga dikubur liang buta, slot hambalan, liang disc, satengah liang, dicampurkeun lamination | Dikubur core PCB magnét | Dikubur kapasitor / résistor, study tambaga di wewengkon parsial, 100% PCB keramik, Sukatani pangélingan nut PCB, komponén study PCB | ||
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