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Pẹlu lori 10 years bi ohun ise olori, YMS jẹ ọkan ninu awọn julọ RÍ PCB ati PCB ijọ išoogun ni China.

A ni o wa lọpọlọpọ lati manufacture ga-didara PCBs ki o si pese ti o dara ju PCB ijọ iṣẹ fun onibara wa.

Wa ìlépa ni lati wa ni tito lẹšẹšẹ bi awọn rọrun tejede Circuit Board olupese lati se owo pẹlu.

imọ Ìwé ibi-ipele kekere ipele ayẹwo
mimọ elo FR4 deede TG Shengyi S1141, KB6160, Huazhen H140 (ko dara fun asiwaju free ilana)
arin TG Fun HDI, ti ọpọlọpọ fẹlẹfẹlẹ: ki o S1000H, ITEQIT158, HuazhengH150; TU-662;
ga TG Fun nipọn Ejò, ga Layer: ki o S1000-2; ITEQIT180A; HuazhengH170; ISOLA: FR408R; 370HR; ​​TU-752;
Halogen ọfẹ Arin TG: ki o S1150G, HuazhengH150HF, H160HF; ga TG: ki o S1165
ga CTI CTI≥600 ki o S1600, Huazheng H1600HF, H1600A;
ga Igbohunsafẹfẹ Rogers, Arlon, Taconic, ki o SCGA-500, S7136; HuazhengH5000
Ere giga Ki o S7439; TU-862HF, TU-872SLK; ISOLA: Mo-Speed, Mo-Tera @ MT40; Huazheng: H175, H180, H380
Flex elo mimọ Pọ-free: Dupont AK XingyangW-Iru, Panosonic RF-775;
Coverlay Ki o SF305C, Xingyang Q-Iru
PP pataki Ko si sisan PP: VT-447LF, Taiguang 370BL Arlon 49N
Seramiki kún alemora dì: Rogers4450F
Ptfe alemora dì: Arlon6700, Taconic FR-27 / FR-28
Double-apa coatingPI: xingyang N-1010TF-MB
irin Mimọ Berguist Al-mimọ, Huazheng Al-mimọ, chaosun Al-mimọ, copperbase
Pataki Ga ooru resistance rigidity PI: Tenghui VT-901, Arlon 85N, ki o S260 (Tg250)
Ga gbona iba ina elekitiriki ohun elo ti: 92ML
Funfun seramiki ohun elo ti: alumina seramiki, Aluminiomu nitride amọ
BT ohun elo ti: Taiwan Nanya NGP-200WT
fẹlẹfẹlẹ FR4 36 60 140
Kosemi & Flex / (Flex) 16 (6) 16 (6) 24 (6)
Ga Igbohunsafẹfẹ ADALU Lamination 12 12 20
100% ptfe 6 6 10
HDI 2 igbesẹ 3 igbesẹ 4 igbesẹ
imọ Atọka ibi-ipele kekere ipele ayẹwo
ifijiṣẹ Iwon Max (mm) 460 * 560 460 * 560 550 * 900
(Mm) Min (mm) 20 * 20 10 * 10 5 * 10
Iwọn / Gap Akojọpọ (mil) 0.5OZ mimọ Ejò: 3/3 1.0OZ mimọ Ejò: 4/4 2.0OZ mimọ Ejò: 5/6
3.0OZ mimọ Ejò: 7/9 4.0OZ mimọ Ejò: 8/12 5.0OZ mimọ Ejò: 10/15
6.0OZ mimọ Ejò: 12/18 10 iwon mimọ Ejò: 18/24 12 iwon mimọ Ejò: 20/28
Lode (mil) 1 / 3OZ mimọ Ejò: 3/3 0.5OZ mimọ Ejò: 4/4 1.0OZ mimọ Ejò: 5/5
2.0OZ mimọ Ejò: 6/8 3.0OZ mimọ Ejò: 7/10 4.0OZ mimọ Ejò: 8/13
5.0OZ mimọ Ejò: 10/16 6.0OZ mimọ Ejò: 12/18 10 iwon mimọ Ejò: 18/24
12 iwon mimọ Ejò: 20/28 15 iwon mimọ Ejò: 24/32
Line iwọn ifarada > 5.0 mil ± 20% ± 20% ± 1.0mil
≤5.0 mil ± 1.0mil ± 1.0mil ± 1.0mil
liluho Min lesa (mm) 0.1 0.1 0.1
Min CNC (mm) 0.2 0.15 0.15
Max CNC lu bit (mm) 6.5 6.5 6.5
Min Half Iho (mm) 0,5 0,4 0,4
PTH Iho (mm) deede ± 0.1 ± 0,075 ± 0,075
titẹ iho ± 0.05 ± 0.05 ± 0.05
Iho Angle (conical) Iwọn ti oke diameter≤6.5mm: 800,900,1000,1100; iwọn ti oke diameter≥6.5mm: 900;
Konge of Ijinle-Iṣakoso liluho (mm) ± 0.10 ± 0,075 ± 0.05
Nọmba ti afọju CNC ihò ti ọkan ẹgbẹ .2 .3 .4
Kere nipasẹ iho aye (ti o yatọ si nẹtiwọki, ologun, egbogi, mọto) mm 0,5 0,45 0,4
Kere nipasẹ iho aye (ti o yatọ si nẹtiwọki, gbogbo ise Iṣakoso ati olumulo ẹrọ itanna) mm 0,4 0.35 0.3
imọ Ìwé ibi-ipele kekere ipele ayẹwo
liluho Awọn kere iho odi aye ti awọn lori iho (kanna nẹtiwọki mm) 0.2 0.2 0.15
Kere iho odi aye (mm) fun ẹrọ ihò 0.8 0,7 0,7
Awọn kere ijinna lati via iho si ni akojọpọ Ejò tabi ila 0.2 0.18 L10L: 0,15
> 10L: 0.18
Awọn min ijinna lati Device iho to akojọpọ Ejò tabi ila 0.3 0,27 0,25
Welding Oruka nipasẹ iho 4 (HDI 3mil) 3.5 (HDI 3mil) 3
(Mil) paati iho 8 6 6
Dam Solder (mil) (Solder boju) 5 4 4
(Arabara) 6 5 5
Ik Board Sisanra > 1.0 mm ± 10% ± 8% ± 8%
≤1.0 mm ± 0.1mm ± 0.1mm ± 0.1mm
Board sisanra (mm) 0,5-5,0 0.4-6.5 0.3-11.5
Board sisanra / lu bit 10:01:00 12:01:00 13:01:00
Nipasẹ iho (lu bit) plug iho (plug solder) 0.25-0.5mm 0.20-0.5mm 0.15-0.6mm
Afọju sin iho, iho inu pad 0.25-0.5mm 0.20-0.5mm 0.10-0.6mm
Teriba ati lilọ ≤0.75% ≤0.75% ≤0.5%
ikọjujasi Iṣakoso ≥5.0mil ± 10% ± 10% ± 8%
<5.0mil ± 10% ± 10% ± 10%
CNC elegbegbe ifarada (mm) ± 0.15 ± 0.10 ± 0.10
V-ge ifarada ti péye sisanra (mm) ± 0.15 ± 0.10 ± 0.10
Afisona Iho (mm) ± 0.15 ± 0.10 ± 0.10
Konge of dari jin milling (mm) ± 0.15 ± 0.10 ± 0.10
imọ Ìwé ibi-ipele kekere ipele ayẹwo
elegbegbe bevel eti 20 ~ 60 ìyí; ± 5degree
dada itọju immersion wura Ni sisanra (bulọọgi inch) 118-236 118-236 118-236
Max wura (uinch) 3 3 6
Lile wura (Au nipọn) Gold ika (uinch) 15 30 60
NiPdAu NI (uinch) 118-236
PA (uinch) 2-5
Au (uinch) 1-5
Awonya ina wura NI (uinch) 120-400
AU (uinch) 1-3
immersion tin Tin (um) 0.8-1.2
immersion Ag Ag (uinch) 6-10
OSP nipọn (um) 0.2-0.5
Hal / Hal LF BGApad (mm) ≥0.3 × 0.3
sisanra (mm) 0.6≤H≤.0.0
Board sisanra vs iho opin Tẹ hole≤3: 1
Tin (um) 2.0-40.0
Kosemi & Flex O pọju aisi-itanna sisanra ti Flex Pọ -Free 25um Pọ-free 75um Pọ-free75um
Flex ara iwọn (mm) ≥10 .5 .5
Max ifijiṣẹ iwọn (mm) 200 × 400 200 × 500 400 × 550
ijinna ti nipasẹ iho to eti ti kosemi & Flex (mm) ≥1.2 ≥1.0 ≥0.8
(Mm) ijinna ti irinše iho si awọn eti ti R & F .51.5 ≥1.2 ≥1.0
imọ Ìwé ibi-ipele kekere ipele ayẹwo
Kosemi & Flex be Awọn lode Layer be ti Flex apakan, awọn PI iranlọwọ be ati awọn Iyapa be Aluminiomu orisun kosemi Flex, kosemi Flex HDI, apapo, ti itanna shielding film
Tech pataki Back liluho PCB, irin ipanu, nipọn Ejò sin afọju iho, igbese Iho, disiki iho, idaji iho, adalu lamination Sin se mojuto PCB Sin kapasito / resistor, ifibọ Ejò ni apa agbegbe, 100% seramiki PCB, sin riveting nut PCB, embedded irinše PCB

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