Baetsi ba Yongmingsheng technology aluminium substrate pcb manufacturer le uena ho utloisisa ts'ebeliso ea aluminium substrate.

Aluminium poleiti (poleiti ea tšepe ea matrix e pholileng (e nang le poleiti ea aluminium, substrate ea koporo,) e tlase e kopanya Al - Mg alloy poleiti - Si polasetiki e phahameng (bona ka tlase) sebopeho, e na le ts'ebetso e ntle ea motlakase, ts'ebetso ea motlakase le ts'ebetso ea machining, poleiti ea aluminium , ha e bapisoa le moetlo oa FR - 4 o sebelisang botenya bo ts'oanang, bophara ba mola o tšoanang, poleiti ea aluminium e ka ts'ehetsa hajoale e phahameng, poleiti ea aluminium e ka ba ho fihlela ho 4500 v voltage, coefficient ea thermal conductivity e kholo ho feta 2.0, e fuoa pele ka aluminium poleiti indastering.

● Theknoloji ea mount mount (SMT);

● Morerong oa moralo oa potoloho bakeng sa ho hasana ha mocheso ke kalafo e sebetsang haholo;

● Fokotsa mocheso o sebetsang oa sehlahisoa, ntlafatsa boleng ba matla a sehlahisoa le ts'epahalo, ho lelefatsa nako ea ts'ebeletso ea sehlahisoa;

● Fokotsa bophahamo ba sehlahisoa, fokotsa thepa le lisebelisoa tsa kopano;

● Kenya sebaka sa `` ceramic '' sa "ceramic" se bonolo bakeng sa mamello e ntlafalitsoeng

Aluminium botlaaseng ba koporo poleiti ke mofuta oa tšepe ea boto ea potoloho, e entsoeng ka foil ea koporo, lera la mocheso le mocheso oa tšepe, sebopeho sa eona se arotsoe likarolo tse tharo:

Layer Line Layer: e lekanang le poleiti e tloaelehileng ea koporo ea PCB, line ea koporo ea koporo LOZ ho isa ho 10oz.

Dielc Triclayer: Insulation layer ke lera la low thermal resistance thermal insulation material. Botenya: 0,003 "ho ea ho 0.006" inch ke theknoloji ea mantlha ea aluminium e nang le likarolo tsa koporo tse koahetsoeng, UL e netefalitsoeng.

Ts'ebeliso ea aluminium substrate. Yongmingsheng ke mofani oa litsebi oa aluminium substrate. Re tšepa hore sengoloa sena u tlameha ho se thusa, amohela bohle hore ba buisane.