Yongmingsheng technology aluminum substrate pcb manufacturer with you to understand the use of aluminum substrate.

Aluminum plate (metal matrix cooling plate (containing aluminum plate, copper substrate,) is low alloying Al - Mg alloy plate - Si high plasticity (see below) structure, it has a good thermal conductivity, electrical insulation performance and machining performance, aluminum plate, compared with the traditional FR - 4 using the same thickness, the same line width, aluminum plate can support higher current, aluminum plate can be up to 4500 v voltage, coefficient of thermal conductivity is greater than 2.0, is given priority to with aluminum plate in the industry.

● Surface mount technology (SMT);

● In the circuit design scheme for the heat diffusion is very effective treatment;

● Reduce the product operating temperature, improve the product power density and reliability, prolong the service life of the product;

● Reduce product volume, reduce hardware and assembly costs;

● Replace fragile ceramic substrate for better mechanical endurance.structure

Aluminum base copper clad plate is a kind of metal circuit board material, composed of copper foil, thermal insulation layer and metal substrate, its structure is divided into three layers:

Cireuitl.Layer Line Layer: equivalent to ordinary PCB copper clad plate, line copper foil thickness LOZ to 10oz.

Dielc Triclayer: Insulation layer is a layer of low thermal resistance thermal insulation material.Thickness: 0.003 "to 0.006" inch is the core technology of aluminum based copper cladded panels, UL certified.

This is the use of aluminum substrate.Yongmingsheng is a professional supplier of aluminum substrate.Hope this article must you help, welcome everyone to consult.