Rigid flex pcb manufacturer HDI staggered vias Stiffener| YMSPCB

Kuerz Beschreiwung:

Rigid flex circuit boards combine the best of both rigid boards and flexible circuits integrated together into one circuit. Bend radius controls the flexibility of the flex portion of the board. The thinner the material the lower the bend radius and the more flexible the flex section.

Parameteren

Schichten: 6L HDI steiwe Flex PCB

Board Thinkness: 0.6mm +/- 0.1mm

PCB Dicke am Flex Sektioun: 0.1mm +/- 0.03 mm

Basismaterial: PI + FR4PP

Min mechanesch Lächer ： 0.15mm

Minimum Linn Breet / Clearance ： 0.05mm / 0.05mm (2mil / 2mil)

Mindest Clearance tëscht Banneschicht PTH a Linn ： 0.2mm

Gréisst ： 160.4mm × 163.2mm

Aspekt Verhältnis ： 4: 1

Uewerfläch Behandlung: ENIG

Spezialitéit: steife Flex PCB HDI gestaffelte Vias Stiffener Edelstahl, Laser iwwer Kupfer plazéiert zou

Differentialimpedanz 100 + 7 / -8Ω

Uwendungen: TWS Kopfhörer

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Produit Gouschteng:

Produit Tags

Wat ass e steife Flex PCB?

Rigid-Flex Print Circuit Boards sinn entwéckelt fir Léisungen ze bidden, an als Ersatz fir starre PCBs. Wéi den Numm et scho seet, sinn dës Circuit Boards eng Hybrid vu flex a starre Circuiten. De Virdeel vun dësem Typ ass datt se d'Virdeeler vu béide steife wéi och flexiblen Circuit Boards weisen.

YMS steiwe Flex PCB Fabrikatiounskapazitéiten :

YMS steiwe Flex PCB Fabrikatiounsfäegkeeten Iwwersiicht
Fonktioun	Fäegkeeten
Schicht Grof	2-20 L
Steiwe-Flex Décken	0,3 mm-5,0 mm
PCB Dicken am Flex Sektioun	0,08-0,8mm
Koffer Déck	1 / 4OZ-10OZ
Minimum Linn Breet a Weltraum	0.05mm / 0.05mm (2mil / 2mil)
Steifwierker	Edelstahl, PI, FR4, Aluminium etc.
Material	Polyimid Flex + FR4, RA Koffer, HTE Koffer, Polyimid, Klebstoff, Bondply
Min mechanesch Boormooss	0.15mm (6mil)
Min Laser Lächer Gréisst:	0,075mm (3mil）
Uewerfläch fäerdeg	Geeignet Mikrowelle / RF PCB Uewerfläch fäerdeg: Elektrolos Nickel, Immersion Gold, ENEPIG, Lead gratis HASL, Immersion Silver.etc.
Solder Mask	Gréng, Rout, Giel, Blo, Wäiss, Schwaarz, Purpur, Matt Schwaarz, Matt Gréng.
Covrelay (Flex Deel)	Giel Coverlay, WhiteCoverlay, Black Coverlay

Allgemeng benotzt FPC Verstäerkter Déck
Versteift Material	Gewéinlech Déck	Ongewéinlech Déck
FR-4	0.2mm (8mil)	0.1mm (4mil)
	0.3mm (12mil)	0,9 mm (35 Mill)
	0.4mm (16mil)	1.1mm (43mil)
	0.5mm (20mil)	1.3mm (51mil)
	0.6mm (24mil)	1.4mm (55mil)
	0.7mm (28mil)	1.6mm (63mil)
	0,8 mm (32 Mill)
	1.0mm (39mil)
	1.2mm (47mil)
	1.5mm (59mil)
Polyimid (PI)	0.1mm (4mil),	0,075mm (3mil)
	0.15mm (6mil),	0,125 mm (5 Mill)
	0.2mm (8mil),	0.175mm (7mil)
	0.25mm (10mil)	0.225mm (9mil)
		0.275mm (11mil)
Edelstol	0.1mm (4mil)	0.45mm (18mil)
	0.15mm (6mil)
	0.2mm (8mil)
	0.25mm (10mil)
	0.3mm (12mil)
	0.35mm (Mil)
	0.4mm (16mil)
	0.5mm (20mil)
	1.5mm (59mil)