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Imbali yophuhliso lwePCB kunye nembali yophuhliso lwase China | YMSPCB

Imbali yoPhuculo lwePCB yeHlabathi

Iibhodi zesekethe ezishicilelweyo zaqala ukusetyenziswa kwizixhobo zerediyo ngo-1936 ngu-Austrian Paul Eisler, umdali wabo.

Ngo-1943, abantu abaninzi baseMelika basebenzisa iteknoloji koonomathotholo emkhosini.

Kwi-1947, i-NASA kunye ne-American Bureau of Standards baqalisa ungcelele lwesibini lwesimanje kwi-PCB.

Ngo-1948, i-Invention yamkelwa ngokusemthethweni e-United States ukuze isetyenziselwe urhwebo.

Kwii-1950s zakuqala, iingxaki zamandla okubambelela kunye nokumelana nokudibanisa i-COPPER Foil kunye ne-laminate yeCCL zisonjululwe, ngokusebenza okuzinzileyo nokuthembekileyo, kunye nemveliso enkulu yoshishino yafezekiswa. I-Copper foil etching yaba yinto ephambili ye-teknoloji yokuvelisa i-PCB, kwaye ukuveliswa kwepaneli enye kwaqalwa.

Ngama-1960, umgodi we-PCB wamacala amabini wagqitywa kwaye ukuveliswa kwemveliso kwafezekiswa.

Ngo-1970, multi-maleko PCB iphuhliswe ngokukhawuleza, kwaye ngokuqhubekekayo phambili kwicala ngqo eliphezulu, ezixineneyo, umgca umngxuma ocoliweyo, ukuthembeka eliphezulu, ixabiso eliphantsi kunye nemveliso oluzenzekelayo oluqhubekayo.

Ngama-1980, umphezulu webhodi eprintiweyo (SMT) ngokuthe ngcembe wayitshintsha i-plug-in ye-plug kwaye waba yeyona nto iphambili kwimveliso.

Ukusukela ngeminyaka yee-1990, ukunyuka komhlaba kuye kwaqhubela phambili kuphuhliswa ukusuka kwiphakheji ethe tyaba (QFP) ukuya kwiphakheji yoluhlu olungqingqwa (BGA).

Ukusukela ekuqaleni kwenkulungwane yama-21, ukuxinana okuphezulu kwe-BGA, ukupakishwa kwenqanaba le-chip kunye nemodyuli yeemodyuli ezininzi ezipakishwe kwibhodi esekwe kwizixhobo ze-organic laminate ziphuhliswe ngokukhawuleza.

https://www.ymspcb.com/2-layer-100z-heavy-copper-board-yms-pcb.html

Imbali ye-PCB e-China

Ngo-1956, i-China yaqala ukuphuhlisa i-PCB.

Kwiminyaka ye-1960, ukuveliswa kwebhetshi kwepaneli enye, imveliso encinci yebhetshi yesikolo esinamacala amabini kwaye yaqala ukuphuhlisa ibhodi ye-multilayer.

Ngeminyaka yoo-1970, ngenxa yokusikelwa umda kweemeko zembali ngelo xesha, ukukhula kancinci kwetekhnoloji ye-PCB kwenza ukuba yonke itekhnoloji yemveliso iwele ngasemva kwinqanaba langaphandle elihambele phambili.

Ngoo-1980, imigca yemveliso phambili kwicala elinye, icala kabini kunye multi-umaleko ibhodi eprintiweyo ziye zaziswa evela phesheya, nto leyo iphucule inqanaba yemveliso technology ibhodi eshicilelweyo China

Ngama-1990, abenzi be-PCB bamanye amazwe abavela eHong Kong, eTaiwan naseJapan beza eChina ukuzakumisela amashishini amdibeneyo kunye nemizi-mveliso ephethwe ngabantu bonke, isenza imveliso yePCB yaseTshayina kunye nobuchwephesha buqhubele phambili ngokukhawuleza.

Ngo-2002, yaba ngumvelisi we-PCB wesithathu omkhulu.

Ngo-2003, ixabiso imveliso kunye Rhweba ngaphakathi no Rhweba ngaphakathi PCB yagqitha kuthi $ 6 billion, ukugqitha United States okokuqala kwaye waba ngumlimi yesibini ngobukhulu PCB ehlabathini. Ixabiso lesiphumo lenyukile ukusuka kwi-8.54% ngo-2000 ukuya kwi-15.30%, iphantse yaphindeka kabini.

Ngo-2006, i-China yagqitha iJapan njengelona lizwe likhulu le-PCB elivelisa ixabiso lalo nelona lizwe linobuchwephesha.

Kwiminyaka yakutshanje, China le-China ligcine ukukhula okuphezulu malunga ne-20%, ephezulu kakhulu kunenqanaba lokukhula kwishishini le-PCB lehlabathi!

https://www.ymspcb.com/12layer-hard-gold-hdi-yms-pcb.html


Ixesha Post: Nov-20-2020
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