High Tg material PCB 6 Layer High Tg Board| YMS PCB

Deskripsi Singkat:

High TG PCBs have an array of applications, from engines to industrial processes, WiFi boosters, and computer systems. They mitigate the internal damage a machine does to itself when it functions by raising the tolerance of a device to heat, moisture, and chemical corrosion. Not only do they improve functionality, but they also enhance the lifespan of PCBs in general by reducing common issues like short-circuiting. If you are looking to get the best-embedded systems or a high TG produsen PCB , look no further. You can use YMS technology to design your high TG PCB boards.

parameter

Layers: 6L High Tg FR4 Material Pemikiran Papan: 1.6mm Base Material:EM827 High tg Lubang Min: 0.2mm Lebar Garis Minimum / Jarak: 0.075mm / 0.075mm Jarak Bebas Minimum antara Lapisan Dalam PTH ke Saluran ： 0.2mm Size：214mm×148mm Aspect Ratio: 8: 1 Permukaan pengobatan: ENIG Single-sided impedance 55Ω±10%, Differential impedance 100+7/-8Ω Applications: Consumer electronics

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High-TG PCB Advanced Circuits Specification

The glass transition temperature of PCB, referred to as "Tg", indicates the point at which the PCB material will begin to transform. If the operating temperature exceeds the designated Tg value, the board will begin to change from a solid to a liquid state, which is likely to have an adverse effect on its ability to function.

Standard PCBs are manufactured with materials offering a TG value of 140°C, which can withstand an operating temperate of 110°C. While this may not be suitable for extreme-temperature processes that are commonplace in applications such as automotive, industrial or high-temperature electronics. In these situations, a PCB made from FR-4 High TG material can often provide the best solution.

YMS High Tg PCB manufacturing capabilities:

YMS High Tg PCB manufacturing capabilities overview
Fitur	kemampuan
Jumlah Lapisan	3-60L
Tersedia Teknologi PCB Multilayer	Lubang tembus dengan Rasio Aspek 16: 1
	terkubur dan buta melalui
	Hibrida	High Frequency Material such as RO4350B and FR4 TG 180°Mix etc.
		High Speed Material such as M7NE and FR4 TG 180°Mix etc.
Ketebalan	0,3 mm-8 mm
Lebar dan Spasi Garis Minimum	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0,35 mm
Ukuran Bor mekanik Min	0,15 mm (6mil)
Rasio Aspek untuk lubang tembus	16: 1
Permukaan Selesai	HASL, HASL bebas timah, ENIG, Timah Perendaman, OSP, Perak Perendaman, Jari Emas, Emas Keras Elektroplating, OSP Selektif, ENEPIG.etc.
Melalui Opsi Isi	The via dilapisi dan diisi dengan epoksi konduktif atau non-konduktif kemudian ditutup dan dilapisi (VIPPO)
	Isi tembaga, isi perak
Registrasi	± 4mil
Topeng solder	Hijau, Merah, Kuning, Biru, Putih, Hitam, Ungu, Matte Black, Matte green. Dll.