High Tg material PCB 6 Layer High Tg Board| YMS PCB

Scurta descriere:

High TG PCBs have an array of applications, from engines to industrial processes, WiFi boosters, and computer systems. They mitigate the internal damage a machine does to itself when it functions by raising the tolerance of a device to heat, moisture, and chemical corrosion. Not only do they improve functionality, but they also enhance the lifespan of PCBs in general by reducing common issues like short-circuiting. If you are looking to get the best-embedded systems or a high TG producător de PCB , look no further. You can use YMS technology to design your high TG PCB boards.

Parametrii

Layers: 6L High Tg FR4 Material Gândire la bord: 1,6 mm Base Material:EM827 High tg Găuri minime: 0,2 mm Lățimea minimă a liniei / degajare ： 0,075 mm / 0,075 mm Distanță minimă între stratul interior PTH până la linia ： 0,2 mm Size：214mm×148mm Aspect Ratio: 8: 1 tratament de suprafață: ENIG Single-sided impedance 55Ω±10%, Differential impedance 100+7/-8Ω Applications: Consumer electronics

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High-TG PCB Advanced Circuits Specification

The glass transition temperature of PCB, referred to as "Tg", indicates the point at which the PCB material will begin to transform. If the operating temperature exceeds the designated Tg value, the board will begin to change from a solid to a liquid state, which is likely to have an adverse effect on its ability to function.

Standard PCBs are manufactured with materials offering a TG value of 140°C, which can withstand an operating temperate of 110°C. While this may not be suitable for extreme-temperature processes that are commonplace in applications such as automotive, industrial or high-temperature electronics. In these situations, a PCB made from FR-4 High TG material can often provide the best solution.

YMS High Tg PCB manufacturing capabilities:

YMS High Tg PCB manufacturing capabilities overview
Caracteristică	capacități
Numărul de straturi	3-60L
Tehnologie PCB multistrat disponibilă	Gaură de trecere cu raport de aspect 16: 1
	îngropat și orb via
	Hibrid	High Frequency Material such as RO4350B and FR4 TG 180°Mix etc.
		High Speed Material such as M7NE and FR4 TG 180°Mix etc.
Grosime	0,3 mm-8 mm
Lățimea și spațiul minim al liniei	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0,35 mm
Dimensiune minimă găurită mecanic	0.15mm (6mil)
Raport de aspect pentru gaura de trecere	16: 1
Finisaj de suprafață	HASL, HASL fără plumb, ENIG, tablă de imersie, OSP, argint de imersie, deget de aur, galvanizare aur dur, OSP selectiv ， ENEPIG.etc.
Opțiunea de umplere	Via este placată și umplută cu epoxid conductiv sau neconductiv, apoi acoperită și placată (VIPPO)
	Umplut cu cupru, umplut cu argint
Înregistrare	± 4mil
Masca de sudura	Verde, roșu, galben, albastru, alb, negru, violet, negru mat, verde mat etc.