Double sided pcb Normal pcb Lead free HASL Counterbore Manufacturer | YMS PCB
HAL(Lead Free), the full name is Hot Air leveling with Lead Free. Compared with HASL, the main difference for HAL(Lead Free) is the element of material which do not contain Lead(Pb), so it’s RoHS Compliant and it’s much more popular and widely used in fabricație PCB .
HAL(Lead Free) requires higher run temperatures for lead free solder and longer contact time, the production cost for HAL(Lead Free) is slightly higher than HASL(Tin/Lead).
The manufacturing process of HAL(Lead Free) is similar to HASL(Tin/Lead), the circuit boards will be submersed in molten solder(Lead Free). This solder will cover all the exposed copper surfaces. Upon retraction from the solder, high pressure hot air is blown over the surface through air knives, this levels the solder deposit and removes the excess solder from the surface of printed circuit boards.
Introducere placă cu circuite imprimate
Placă de circuit imprimat normală: Most PCBs for simple electronics are simple and composed of only a single layer. More sophisticated hardware such as computer graphics cards or motherboards can have 2 or multiple layers, sometimes up to twelve.
A printed circuit board (PCB) mechanically supports and electrically connects electrical or electronic components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Components are generally soldered onto the PCB to both electrically connect and mechanically fasten them to it.PCBs can be single-sided (one copper layer), double-sided (two copper layers on both sides of one substrate layer), or multi-layer (outer and inner layers of copper, alternating with layers of substrate). Multi-layer PCBs allow for much higher component density, because circuit traces on the inner layers would otherwise take up surface space between components. The rise in popularity of multilayer PCBs with more than two, and especially with more than four, copper planes was concurrent with the adoption of surface mount technology.
What is the difference between a Countersink and a Counterbore?
Capacități de fabricație PCB normale YMS:
| YMS Prezentare generală a capacităților de fabricație PCB normale | ||
| Caracteristică | capacități | |
| Numărul de straturi | 1-60L | |
| Tehnologie normală PCB disponibilă | Gaură de trecere cu raport de aspect 16: 1 | |
| îngropat și orb via | ||
| Hibrid | Material de înaltă frecvență, cum ar fi RO4350B și FR4 Mix etc. | |
| Material de mare viteză, cum ar fi M7NE și FR4 Mix etc. | ||
| Material | CEM- | CEM-1; CEM-2 ； CEM-4 ； CEM-5.etc |
| FR4 | EM827, 370HR, S1000-2, IT180A, IT158, S1000 / S1155, R1566W, EM285, TU862HF, NP170G etc. | |
| Viteza mare | Megtron6, Megtron4, Megtron7, TU872SLK, FR408HR, Seria N4000-13, MW4000, MW2000, TU933 etc. | |
| Frecventa inalta | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 etc. | |
| Alții | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega, ZBC2000, PEEK, PTFE, pe bază de ceramică etc. | |
| Grosime | 0,3 mm-8 mm | |
| Grosimea maximă a cuprului | 10 OZ | |
| Lățimea și spațiul minim al liniei | 0.05mm / 0.05mm (2mil / 2mil) | |
| BGA PITCH | 0,35 mm | |
| Dimensiune minimă găurită mecanic | 0.15mm (6mil) | |
| Raport de aspect pentru gaura de trecere | 16 ： 1 | |
| Finisaj de suprafață | HASL, HASL fără plumb, ENIG, tablă de imersie, OSP, argint de imersie, deget de aur, galvanizare aur dur, OSP selectiv ， ENEPIG.etc. | |
| Opțiunea de umplere | Via este placată și umplută cu epoxid conductiv sau neconductiv, apoi acoperită și placată (VIPPO) | |
| Umplut cu cupru, umplut cu argint | ||
| Înregistrare | ± 4mil | |
| Masca de sudura | Verde, roșu, galben, albastru, alb, negru, violet, negru mat, verde mat etc. | |
S-ar putea să-ți placă:
1, Summary of matters needing attention in circuit board welding
3, What is PCB
5. Ce este designul PCB de înaltă frecvență
Aflați mai multe despre produsele YMS
