Double sided pcb Normal pcb Lead free HASL Counterbore Manufacturer | YMS PCB
HAL(Lead Free), the full name is Hot Air leveling with Lead Free. Compared with HASL, the main difference for HAL(Lead Free) is the element of material which do not contain Lead(Pb), so it’s RoHS Compliant and it’s much more popular and widely used in PCB-fabrikado.
HAL(Lead Free) requires higher run temperatures for lead free solder and longer contact time, the production cost for HAL(Lead Free) is slightly higher than HASL(Tin/Lead).
The manufacturing process of HAL(Lead Free) is similar to HASL(Tin/Lead), the circuit boards will be submersed in molten solder(Lead Free). This solder will cover all the exposed copper surfaces. Upon retraction from the solder, high pressure hot air is blown over the surface through air knives, this levels the solder deposit and removes the excess solder from the surface of printed circuit boards.
Enkonduko de Presita Cirkvita Tabulo
Normala Presita Cirkvito: Most PCBs for simple electronics are simple and composed of only a single layer. More sophisticated hardware such as computer graphics cards or motherboards can have 2 or multiple layers, sometimes up to twelve.
A printed circuit board (PCB) mechanically supports and electrically connects electrical or electronic components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Components are generally soldered onto the PCB to both electrically connect and mechanically fasten them to it.PCBs can be single-sided (one copper layer), double-sided (two copper layers on both sides of one substrate layer), or multi-layer (outer and inner layers of copper, alternating with layers of substrate). Multi-layer PCBs allow for much higher component density, because circuit traces on the inner layers would otherwise take up surface space between components. The rise in popularity of multilayer PCBs with more than two, and especially with more than four, copper planes was concurrent with the adoption of surface mount technology.
What is the difference between a Countersink and a Counterbore?
Kapabloj de fabrikado de YMS-Normala PCB:
| Superrigardo de YMS-Normala PCB-fabrikado | ||
| Trajto | kapabloj | |
| Tavola Kalkulo | 1-60L | |
| Havebla Normala PCB-Teknologio | Tra truo kun Bildformo 16: 1 | |
| entombigita kaj blinda per | ||
| Hibrida | Altfrekvenca Materialo kiel RO4350B kaj FR4 Mix ktp. | |
| Altrapida Materialo kiel M7NE kaj FR4 Mix ktp. | ||
| Materialo | CEM- | CEM-1; CEM-2 ； CEM-4 ； CEM-5. ktp |
| FR4 | EM827, 370HR, S1000-2, IT180A, IT158, S1000 / S1155, R1566W, EM285, TU862HF, NP170G ktp. | |
| alta rapido | Megtron6, Megtron4, Megtron7, TU872SLK, FR408HR, N4000-13 Series, MW4000, MW2000, TU933 ktp. | |
| alta Ofteco | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 ktp. | |
| Aliaj | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega, ZBC2000, PEEK, PTFE, ceramika-bazita ktp. | |
| Dikeco | 0.3mm-8mm | |
| Maksimuma kupra dikeco | 10 OZ | |
| Minimuma linio Larĝo kaj Spaco | 0.05mm / 0.05mm (2mil / 2mil) | |
| BGA-PIKTO | 0.35mm | |
| Min mekanika Borita Grandeco | 0.15mm (6mil) | |
| Aspektoproporcio por tra truo | 16 ： 1 | |
| Surfaca Finiĝo | HASL, Senplumba HASL, ENIG, Mergada Stano, OSP, Mergenta Arĝento, Ora Fingro, Galvanizado de Malmola Oro, Selektema OSP ， ENEPIG.etc. | |
| Tra Pleniga Opcio | La vojo estas tegita kaj plenigita per aŭ konduka aŭ nekondukta epoksio tiam limigita kaj tegita (VIPPO) | |
| Kupro plenigita, arĝenta plenpleno | ||
| Aliĝo | ± 4mil | |
| Solda Masko | Verda, Ruĝa, Flava, Blua, Blanka, Nigra, Purpura, Mata Nigra, Mata verda.etc. | |
Vi Povas Ŝati:
1、Summary of matters needing attention in circuit board welding
4、Kio estas nuda tabula testado?
5. Kio estas altfrekvenca PCB-dezajno
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