Double sided pcb Normal pcb Lead free HASL Counterbore Manufacturer | YMS PCB
HAL(Lead Free), the full name is Hot Air leveling with Lead Free. Compared with HASL, the main difference for HAL(Lead Free) is the element of material which do not contain Lead(Pb), so it’s RoHS Compliant and it’s much more popular and widely used in ຜະລິດ .
HAL(Lead Free) requires higher run temperatures for lead free solder and longer contact time, the production cost for HAL(Lead Free) is slightly higher than HASL(Tin/Lead).
The manufacturing process of HAL(Lead Free) is similar to HASL(Tin/Lead), the circuit boards will be submersed in molten solder(Lead Free). This solder will cover all the exposed copper surfaces. Upon retraction from the solder, high pressure hot air is blown over the surface through air knives, this levels the solder deposit and removes the excess solder from the surface of printed circuit boards.
ຄຳ ແນະ ນຳ ກ່ຽວກັບການພິມປ້າຍວົງຈອນ
ກະດານວົງຈອນພິມປົກກະຕິ: Most PCBs for simple electronics are simple and composed of only a single layer. More sophisticated hardware such as computer graphics cards or motherboards can have 2 or multiple layers, sometimes up to twelve.
A printed circuit board (PCB) mechanically supports and electrically connects electrical or electronic components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Components are generally soldered onto the PCB to both electrically connect and mechanically fasten them to it.PCBs can be single-sided (one copper layer), double-sided (two copper layers on both sides of one substrate layer), or multi-layer (outer and inner layers of copper, alternating with layers of substrate). Multi-layer PCBs allow for much higher component density, because circuit traces on the inner layers would otherwise take up surface space between components. The rise in popularity of multilayer PCBs with more than two, and especially with more than four, copper planes was concurrent with the adoption of surface mount technology.
What is the difference between a Countersink and a Counterbore?
YMS ຄວາມສາມາດໃນການຜະລິດ PCB ປົກກະຕິ:
| ພາບລວມຄວາມສາມາດໃນການຜະລິດ PCB ຂອງ YMS | ||
| ຄຸນນະສົມບັດ | ຄວາມສາມາດ | |
| ຈຳ ນວນຊັ້ນ | 1-60L | |
| ມີເຕັກໂນໂລຍີ PCB ທຳ ມະດາ | ຜ່ານຂຸມກັບ Aspect Ratio 16: 1 | |
| ຝັງແລະຕາບອດຜ່ານ | ||
| ປະສົມ | ວັດສະດຸທີ່ມີຄວາມຖີ່ສູງເຊັ່ນ RO4350B ແລະ FR4 Mix ເປັນຕົ້ນ. | |
| ວັດສະດຸຄວາມໄວສູງເຊັ່ນ M7NE ແລະ FR4 Mix ເປັນຕົ້ນ. | ||
| ວັດສະດຸ | CEM- | CEM-1; CEM-2； CEM-4； CEM-5.etc |
| FR4 | EM827, 370HR, S1000-2, IT180A, IT158, S1000 / S1155, R1566W, EM285, TU862HF, NP170G ແລະອື່ນໆ. | |
| ຄວາມໄວສູງ | Megtron6, Megtron4, Megtron7, TU872SLK, FR408HR, N4000-13 Series, MW4000, MW2000, TU933 ແລະອື່ນໆ. | |
| ຄວາມຖີ່ສູງ | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 ແລະອື່ນໆ. | |
| ອື່ນໆ | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega, ZBC2000, PEEK, PTFE, ceramic ແລະອື່ນໆ. | |
| ຄວາມ ໜາ | ຂະ ໜາດ 0.3mm-8mm | |
| ຄວາມຫນາ Max.copper | 10 ອໍ | |
| ເສັ້ນຄວາມກວ້າງແລະຊ່ອງນ້ອຍສຸດ | 0.05mm / 0.05mm (2mil / 2mil) | |
| BGA PITCH | ຂະ ໜາດ 0.35mm | |
| ຂະ ໜາດ ເຈາະກົນຈັກ ໜ້ອຍ | 0.15mm (6mil) | |
| ອັດຕາສ່ວນ ສຳ ລັບຜ່ານຮູ | 16： 1 | |
| ດ້ານ ສຳ ເລັດຮູບ | HASL, Lead free HASL, ENIG, Immersion Tin, OSP, ເງິນດູດຊຶມ, ນິ້ວມື ຄຳ, Electroplating ຄຳ ແຂງ, ຄຳ ທີ່ເລືອກ OSP， ENEPIG.etc | |
| ຜ່ານ Option Option | ທາງຜ່ານແມ່ນຖືກຈັດໃສ່ແລະເຕັມໄປດ້ວຍ epoxy ທີ່ບໍ່ສາມາດປະຕິບັດໄດ້ຫຼືບໍ່ແມ່ນການປະພຶດ. | |
| ທອງແດງທີ່ເຕັມໄປ, ເງິນເຕັມໄປ | ||
| ການລົງທະບຽນ | ± 4mil | |
| ຫນ້າກາກ Solder | ສີຂຽວ, ສີແດງ, ສີເຫຼືອງ, ສີຟ້າ, ສີຂາວ, ສີ ດຳ, ສີມ່ວງ, ສີດໍາ Matte, Matte green.etc. | |
ທ່ານອາດຈະມັກ:
1, Summary of matters needing attention in circuit board welding
3, What is PCB
4、ການທົດສອບກະດານເປົ່າແມ່ນຫຍັງ?
5. ການອອກແບບ PCB ຄວາມຖີ່ສູງແມ່ນຫຍັງ
ຮຽນຮູ້ເພີ່ມເຕີມກ່ຽວກັບຜະລິດຕະພັນ YMS
