Double sided pcb Normal pcb Lead free HASL Counterbore Manufacturer | YMS PCB
HAL(Lead Free), the full name is Hot Air leveling with Lead Free. Compared with HASL, the main difference for HAL(Lead Free) is the element of material which do not contain Lead(Pb), so it’s RoHS Compliant and it’s much more popular and widely used in fabricação de PCB .
HAL(Lead Free) requires higher run temperatures for lead free solder and longer contact time, the production cost for HAL(Lead Free) is slightly higher than HASL(Tin/Lead).
The manufacturing process of HAL(Lead Free) is similar to HASL(Tin/Lead), the circuit boards will be submersed in molten solder(Lead Free). This solder will cover all the exposed copper surfaces. Upon retraction from the solder, high pressure hot air is blown over the surface through air knives, this levels the solder deposit and removes the excess solder from the surface of printed circuit boards.
Introdução à placa de circuito impresso
Placa de circuito impresso normal: Most PCBs for simple electronics are simple and composed of only a single layer. More sophisticated hardware such as computer graphics cards or motherboards can have 2 or multiple layers, sometimes up to twelve.
A printed circuit board (PCB) mechanically supports and electrically connects electrical or electronic components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Components are generally soldered onto the PCB to both electrically connect and mechanically fasten them to it.PCBs can be single-sided (one copper layer), double-sided (two copper layers on both sides of one substrate layer), or multi-layer (outer and inner layers of copper, alternating with layers of substrate). Multi-layer PCBs allow for much higher component density, because circuit traces on the inner layers would otherwise take up surface space between components. The rise in popularity of multilayer PCBs with more than two, and especially with more than four, copper planes was concurrent with the adoption of surface mount technology.
What is the difference between a Countersink and a Counterbore?
Capacidades de fabricação de PCB normal de YMS:
| Visão geral dos recursos de fabricação de PCB normal de YMS | ||
| Característica | capacidades | |
| Contagem de Camadas | 1-60L | |
| Tecnologia de PCB normal disponível | Orifício de passagem com proporção de aspecto 16: 1 | |
| enterrado e cego via | ||
| Híbrido | Material de alta frequência, como RO4350B e FR4 Mix etc. | |
| Material de alta velocidade, como M7NE e FR4 Mix etc. | ||
| Material | CEM- | CEM-1; CEM-2 ； CEM-4 ； CEM-5.etc |
| FR4 | EM827, 370HR, S1000-2, IT180A, IT158, S1000 / S1155, R1566W, EM285, TU862HF, NP170G etc. | |
| Alta velocidade | Megtron6, Megtron4, Megtron7, TU872SLK, FR408HR, Série N4000-13, MW4000, MW2000, TU933 etc. | |
| Alta frequência | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 etc. | |
| Outras | Poliimida, Tk, LCP, BT, C-ply, Fradflex, Omega, ZBC2000, PEEK, PTFE, à base de cerâmica etc. | |
| Espessura | 0,3 mm-8 mm | |
| Espessura máxima de cobre | 10OZ | |
| Largura e espaço mínimos da linha | 0,05 mm / 0,05 mm (2mil / 2mil) | |
| BGA PITCH | 0,35 mm | |
| Tamanho mínimo de perfuração mecânica | 0,15 mm (6mil) | |
| Proporção para orifício de passagem | 16 ： 1 | |
| Acabamento de superfície | HASL, HASL sem chumbo, ENIG, Lata de imersão, OSP, Prata de imersão, Dedo de ouro, Galvanoplastia de ouro duro, OSP seletivo ， ENEPIG.etc. | |
| Via opção de preenchimento | A via é revestida e preenchida com epóxi condutivo ou não condutivo e então tampada e revestida (VIPPO) | |
| Preenchido com cobre, preenchido com prata | ||
| Cadastro | ± 4mil | |
| Máscara de Solda | Verde, vermelho, amarelo, azul, branco, preto, roxo, preto fosco, verde fosco etc. | |
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