Double sided pcb Normal pcb Lead free HASL Counterbore Manufacturer | YMS PCB
HAL(Lead Free), the full name is Hot Air leveling with Lead Free. Compared with HASL, the main difference for HAL(Lead Free) is the element of material which do not contain Lead(Pb), so it’s RoHS Compliant and it’s much more popular and widely used in fabricació de PCB .
HAL(Lead Free) requires higher run temperatures for lead free solder and longer contact time, the production cost for HAL(Lead Free) is slightly higher than HASL(Tin/Lead).
The manufacturing process of HAL(Lead Free) is similar to HASL(Tin/Lead), the circuit boards will be submersed in molten solder(Lead Free). This solder will cover all the exposed copper surfaces. Upon retraction from the solder, high pressure hot air is blown over the surface through air knives, this levels the solder deposit and removes the excess solder from the surface of printed circuit boards.
Introducció a la placa de circuit imprès
Placa de circuit imprès normal: Most PCBs for simple electronics are simple and composed of only a single layer. More sophisticated hardware such as computer graphics cards or motherboards can have 2 or multiple layers, sometimes up to twelve.
A printed circuit board (PCB) mechanically supports and electrically connects electrical or electronic components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Components are generally soldered onto the PCB to both electrically connect and mechanically fasten them to it.PCBs can be single-sided (one copper layer), double-sided (two copper layers on both sides of one substrate layer), or multi-layer (outer and inner layers of copper, alternating with layers of substrate). Multi-layer PCBs allow for much higher component density, because circuit traces on the inner layers would otherwise take up surface space between components. The rise in popularity of multilayer PCBs with more than two, and especially with more than four, copper planes was concurrent with the adoption of surface mount technology.
What is the difference between a Countersink and a Counterbore?
Capacitats de fabricació de PCB normals YMS:
| Descripció general de les capacitats de fabricació de PCB normals YMS | ||
| Funció | capacitats | |
| Recompte de capes | 1-60L | |
| Tecnologia de PCB normal disponible | Forat passant amb una relació d'aspecte 16: 1 | |
| enterrat i cec via | ||
| Híbrid | Material d'alta freqüència com ara RO4350B i FR4 Mix, etc. | |
| Material d'alta velocitat com M7NE i FR4 Mix, etc. | ||
| Material | CEM- | CEM-1; CEM-2 ； CEM-4 ； CEM-5.etc |
| FR4 | EM827, 370HR, S1000-2, IT180A, IT158, S1000 / S1155, R1566W, EM285, TU862HF, NP170G, etc. | |
| Alta velocitat | Megtron6, Megtron4, Megtron7, TU872SLK, FR408HR, Sèrie N4000-13, MW4000, MW2000, TU933, etc. | |
| Alta freqüència | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27, etc. | |
| Altres | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega, ZBC2000, PEEK, PTFE, a base de ceràmica, etc. | |
| Gruix | 0,3 mm-8 mm | |
| Gruix màxim del coure | 10 oz | |
| Amplada i espai mínim de la línia | 0,05 mm / 0,05 mm (2 mil / 2 mil) | |
| BGA PITCH | 0,35 mm | |
| Mida mínima perforada mecànica | 0,15 mm (6 mil) | |
| Relació d'aspecte per al forat passant | 16 ： 1 | |
| Acabat superficial | HASL, HASL sense plom, ENIG, llauna d’immersió, OSP, plata d’immersió, dit d’or, daurat galvanitzat, OSP selectiu ， ENEPIG.etc. | |
| Opció d'emplenament mitjançant | La via es xapa i s’omple amb epoxi conductor o no conductor, després es tapa i es xapa (VIPPO) | |
| Farcit de coure, farcit de plata | ||
| Inscripció | ± 4mil | |
| Màscara de soldadura | Verd, vermell, groc, blau, blanc, negre, morat, negre mat, verd mat, etc. | |
Us pot agradar:
1、Summary of matters needing attention in circuit board welding
3, What is PCB
4、Què són les proves de tauler nu?
5. Què és el disseny de PCB d'alta freqüència
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