Double sided pcb Normal pcb Lead free HASL Counterbore Manufacturer | YMS PCB
HAL(Lead Free), the full name is Hot Air leveling with Lead Free. Compared with HASL, the main difference for HAL(Lead Free) is the element of material which do not contain Lead(Pb), so it’s RoHS Compliant and it’s much more popular and widely used in proizvodnje tiskanih vezij .
HAL(Lead Free) requires higher run temperatures for lead free solder and longer contact time, the production cost for HAL(Lead Free) is slightly higher than HASL(Tin/Lead).
The manufacturing process of HAL(Lead Free) is similar to HASL(Tin/Lead), the circuit boards will be submersed in molten solder(Lead Free). This solder will cover all the exposed copper surfaces. Upon retraction from the solder, high pressure hot air is blown over the surface through air knives, this levels the solder deposit and removes the excess solder from the surface of printed circuit boards.
Uvod v tiskano vezje
Običajno tiskano vezje: Most PCBs for simple electronics are simple and composed of only a single layer. More sophisticated hardware such as computer graphics cards or motherboards can have 2 or multiple layers, sometimes up to twelve.
A printed circuit board (PCB) mechanically supports and electrically connects electrical or electronic components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Components are generally soldered onto the PCB to both electrically connect and mechanically fasten them to it.PCBs can be single-sided (one copper layer), double-sided (two copper layers on both sides of one substrate layer), or multi-layer (outer and inner layers of copper, alternating with layers of substrate). Multi-layer PCBs allow for much higher component density, because circuit traces on the inner layers would otherwise take up surface space between components. The rise in popularity of multilayer PCBs with more than two, and especially with more than four, copper planes was concurrent with the adoption of surface mount technology.
What is the difference between a Countersink and a Counterbore?
YMS Običajne proizvodne zmogljivosti PCB:
| Pregled zmogljivosti običajnega tiskanja tiskanih vezij YMS | ||
| Značilnost | zmogljivosti | |
| Število slojev | 1-60 l | |
| Na voljo običajna tehnologija PCB | Skozi luknjo z razmerjem stranic 16: 1 | |
| pokopan in slep | ||
| Hibridna | Visokofrekvenčni materiali, kot so RO4350B in FR4 Mix itd. | |
| Visokohitrostni materiali, kot so M7NE in FR4 Mix itd. | ||
| material | CEM- | CEM-1; CEM-2, CEM-4, CEM-5. itd |
| FR4 | EM827, 370HR, S1000-2, IT180A, IT158, S1000 / S1155, R1566W, EM285, TU862HF, NP170G itd. | |
| Visoka hitrost | Megtron6, Megtron4, Megtron7, TU872SLK, FR408HR, N4000-13 Series, MW4000, MW2000, TU933 itd. | |
| Visoka frekvenca | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 itd. | |
| Drugi | Poliimid, Tk, LCP, BT, C-sloj, Fradflex, Omega, ZBC2000, PEEK, PTFE, na keramični osnovi itd. | |
| Debelina | 0,3 mm-8 mm | |
| Največja debelina bakra | 10 oz | |
| Najmanjša širina črte in presledek | 0,05 mm / 0,05 mm (2 mil / 2 mil) | |
| BGA PITCH | 0,35 mm | |
| Min. Mehanska vrtana velikost | 0,15 mm (6 mil) | |
| Razmerje stranic skozi luknjo | 16: 1 | |
| Površinska obdelava | HASL, brez svinca HASL, ENIG, potopni kositer, OSP, potopno srebro, zlati prst, galvansko trdo zlato, selektivni OSP ， ENEPIG.itd. | |
| Prek možnosti polnjenja | Prehod je prekrit in napolnjen s prevodnim ali neprevodnim epoksidom, nato zaprt in prekrit (VIPPO) | |
| Napolnjen z bakrom, napolnjen s srebrom | ||
| Registracija | ± 4mil | |
| Maska za spajkanje | Zelena, rdeča, rumena, modra, bela, črna, vijolična, mat črna, mat zelena itd. | |
Tako lahko, kot:
1, Povzetek zadeve, ki potrebujejo pomoč pri platini varjenje
3, Kaj je PCB
4、Kaj je testiranje gole plošče?
5. Kaj je visokofrekvenčna zasnova PCB
Več o izdelkih YMS
