Double sided pcb Normal pcb Lead free HASL Counterbore Manufacturer | YMS PCB
HAL(Lead Free), the full name is Hot Air leveling with Lead Free. Compared with HASL, the main difference for HAL(Lead Free) is the element of material which do not contain Lead(Pb), so it’s RoHS Compliant and it’s much more popular and widely used in PCB üretim .
HAL(Lead Free) requires higher run temperatures for lead free solder and longer contact time, the production cost for HAL(Lead Free) is slightly higher than HASL(Tin/Lead).
The manufacturing process of HAL(Lead Free) is similar to HASL(Tin/Lead), the circuit boards will be submersed in molten solder(Lead Free). This solder will cover all the exposed copper surfaces. Upon retraction from the solder, high pressure hot air is blown over the surface through air knives, this levels the solder deposit and removes the excess solder from the surface of printed circuit boards.
Baskılı Devre Kartı Giriş
Normal Baskılı Devre Kartı: Most PCBs for simple electronics are simple and composed of only a single layer. More sophisticated hardware such as computer graphics cards or motherboards can have 2 or multiple layers, sometimes up to twelve.
A printed circuit board (PCB) mechanically supports and electrically connects electrical or electronic components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Components are generally soldered onto the PCB to both electrically connect and mechanically fasten them to it.PCBs can be single-sided (one copper layer), double-sided (two copper layers on both sides of one substrate layer), or multi-layer (outer and inner layers of copper, alternating with layers of substrate). Multi-layer PCBs allow for much higher component density, because circuit traces on the inner layers would otherwise take up surface space between components. The rise in popularity of multilayer PCBs with more than two, and especially with more than four, copper planes was concurrent with the adoption of surface mount technology.
What is the difference between a Countersink and a Counterbore?
YMS Normal PCB üretim yetenekleri:
| YMS Normal PCB üretim yeteneklerine genel bakış | ||
| Özellik | yetenekler | |
| Katman Sayısı | 1-60L | |
| Mevcut Normal PCB Teknolojisi | En Boy Oranı 16: 1 ile açık delik | |
| gömülü ve kör | ||
| Hibrit | RO4350B ve FR4 Mix gibi Yüksek Frekanslı Malzemeler | |
| M7NE ve FR4 Mix gibi Yüksek Hızlı Malzemeler | ||
| Malzeme | CEM- | CEM-1; CEM-2 ； CEM-4 ； CEM-5.etc |
| FR4'de | EM827, 370HR, S1000-2, IT180A, IT158, S1000 / S1155, R1566W, EM285, TU862HF, NP170G vb. | |
| Yüksek hız | Megtron6, Megtron4, Megtron7, TU872SLK, FR408HR, N4000-13 Serisi, MW4000, MW2000, TU933 vb. | |
| Yüksek frekans | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 vb. | |
| Diğerleri | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega, ZBC2000, PEEK, PTFE, seramik bazlı vb. | |
| Kalınlık | 0,3 mm-8 mm | |
| Maks. Bakır Kalınlığı | 10 OZ | |
| Minimum çizgi Genişliği ve Boşluğu | 0.05mm / 0.05mm (2mil / 2mil) | |
| BGA SAHNE | 0,35 mm | |
| Min mekanik Delinmiş Boyut | 0.15 mm (6mil) | |
| Açık delik için En Boy Oranı | 16 ： 1 | |
| Yüzey | HASL, Kurşunsuz HASL, ENIG, Daldırma Kalay, OSP, Daldırma Gümüş, Altın Parmak, Elektrokaplama Sert Altın, Seçici OSP ， ENEPIG.etc. | |
| Doldurma Seçeneği ile | Yol kaplanır ve iletken veya iletken olmayan epoksi ile doldurulur, ardından kapatılır ve üzeri kaplanır (VIPPO) | |
| Bakır dolgulu, gümüş dolgulu | ||
| Kayıt | ± 4mil | |
| Lehim maskesi | Yeşil, Kırmızı, Sarı, Mavi, Beyaz, Siyah, Mor, Mat Siyah, Mat yeşil.etc. | |
Beğenebilirsin:
1、Summary of matters needing attention in circuit board welding
5. Yüksek frekanslı PCB tasarımı nedir
YMS ürünleri hakkında daha fazla bilgi edinin
