Double sided pcb Normal pcb Lead free HASL Counterbore Manufacturer | YMS PCB
HAL(Lead Free), the full name is Hot Air leveling with Lead Free. Compared with HASL, the main difference for HAL(Lead Free) is the element of material which do not contain Lead(Pb), so it’s RoHS Compliant and it’s much more popular and widely used in पीसीबी उत्पादन .
HAL(Lead Free) requires higher run temperatures for lead free solder and longer contact time, the production cost for HAL(Lead Free) is slightly higher than HASL(Tin/Lead).
The manufacturing process of HAL(Lead Free) is similar to HASL(Tin/Lead), the circuit boards will be submersed in molten solder(Lead Free). This solder will cover all the exposed copper surfaces. Upon retraction from the solder, high pressure hot air is blown over the surface through air knives, this levels the solder deposit and removes the excess solder from the surface of printed circuit boards.
मुद्रित सर्किट बोर्ड परिचय
सामान्य मुद्रित सर्किट बोर्ड: Most PCBs for simple electronics are simple and composed of only a single layer. More sophisticated hardware such as computer graphics cards or motherboards can have 2 or multiple layers, sometimes up to twelve.
A printed circuit board (PCB) mechanically supports and electrically connects electrical or electronic components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Components are generally soldered onto the PCB to both electrically connect and mechanically fasten them to it.PCBs can be single-sided (one copper layer), double-sided (two copper layers on both sides of one substrate layer), or multi-layer (outer and inner layers of copper, alternating with layers of substrate). Multi-layer PCBs allow for much higher component density, because circuit traces on the inner layers would otherwise take up surface space between components. The rise in popularity of multilayer PCBs with more than two, and especially with more than four, copper planes was concurrent with the adoption of surface mount technology.
What is the difference between a Countersink and a Counterbore?
वाईएमएस सामान्य पीसीबी उत्पादन क्षमताः
| वाईएमएस सामान्य पीसीबी उत्पादन क्षमतांचे विहंगावलोकन | ||
| वैशिष्ट्य | क्षमता | |
| स्तर संख्या | 1-60 एल | |
| उपलब्ध सामान्य पीसीबी तंत्रज्ञान | आस्पेक्ट रेश्यो 16: 1 सह छिद्रातून | |
| दफन आणि अंध | ||
| संकरित | आरओ 4350 बी आणि एफआर 4 मिक्स इत्यादीसारख्या उच्च वारंवारतेची सामग्री | |
| एम 7 एनई आणि एफआर 4 मिक्स इत्यादीसारखी उच्च गति सामग्री | ||
| साहित्य | सीईएम- | सीईएम -1; सीईएम -2 ； सीईईएम -4 ； सीईईएम -5 इ |
| एफआर 4 | EM827, 370HR, S1000-2, IT180A, IT158, S1000 / S1155, R1566W, EM285, TU862HF, NP170G इ. | |
| हाय स्पीड | Megtron6, Megtron4, Megtron7, TU872SLK, FR408HR, N4000-13 मालिका, MW4000, MW2000, TU933 इ. | |
| उच्च वारंवारता | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, सीएलटीई, जेनक्लॅड, आरएफ 35, फास्टराइझ 27 इ. | |
| इतर | पॉलिमाईड, टी, एलसीपी, बीटी, सी-प्लाय, फ्रेडफ्लेक्स, ओमेगा, झेडबीसी 2000, पीईईके, पीटीएफई, सिरेमिक-आधारित इ. | |
| जाडी | 0.3 मिमी -8 मिमी | |
| मॅक्सकॉपर जाडी | 10 ओझेड | |
| किमान रेखा रुंदी आणि जागा | 0.05 मिमी / 0.05 मिमी (2 मिली / 2 मिली) | |
| बीजीए पिच | 0.35 मिमी | |
| किमान यांत्रिक ड्रिल आकार | 0.15 मिमी (6 मिली) | |
| छिद्रातून आस्पेक्ट रेशो | 16 ： 1 | |
| पृष्ठभाग समाप्त | एचएएसएल, लीड फ्री एचएएसएल, एनआयजी, विसर्जन टिन, ओएसपी, विसर्जन चांदी, गोल्ड फिंगर, इलेक्ट्रोप्लेटिंग हार्ड गोल्ड, सिलेक्टिव ओएसपी ， एनईपीआयजी.एटसी. | |
| भरा पर्याय द्वारे | मार्ग प्लेटेड आणि एकतर वाहक किंवा नॉन-कंडक्टिव इपॉक्सीने भरला आहे नंतर कॅप्ड आणि प्लेटेड ओव्हर (व्हीआयपीपीओ) | |
| तांबे भरला, चांदी भरली | ||
| नोंदणी | M 4 मिल | |
| सोल्डर मास्क | हिरवा, लाल, पिवळा, निळा, पांढरा, काळा, जांभळा, मॅट ब्लॅक, मॅट ग्रीन.एटसी. | |
आपणास आवडेलः
1, Summary of matters needing attention in circuit board welding
3, What is PCB
4、बेअर बोर्ड टेस्टिंग म्हणजे काय?
5. उच्च वारंवारता पीसीबी डिझाइन काय आहे
YMS उत्पादनांबद्दल अधिक जाणून घ्या
