Double sided pcb Normal pcb Lead free HASL Counterbore Manufacturer | YMS PCB
HAL(Lead Free), the full name is Hot Air leveling with Lead Free. Compared with HASL, the main difference for HAL(Lead Free) is the element of material which do not contain Lead(Pb), so it’s RoHS Compliant and it’s much more popular and widely used in manufaktur PCB .
HAL(Lead Free) requires higher run temperatures for lead free solder and longer contact time, the production cost for HAL(Lead Free) is slightly higher than HASL(Tin/Lead).
The manufacturing process of HAL(Lead Free) is similar to HASL(Tin/Lead), the circuit boards will be submersed in molten solder(Lead Free). This solder will cover all the exposed copper surfaces. Upon retraction from the solder, high pressure hot air is blown over the surface through air knives, this levels the solder deposit and removes the excess solder from the surface of printed circuit boards.
Pengantar Papan Sirkuit Cetak
Papan Sirkuit Cetak Normal: Most PCBs for simple electronics are simple and composed of only a single layer. More sophisticated hardware such as computer graphics cards or motherboards can have 2 or multiple layers, sometimes up to twelve.
A printed circuit board (PCB) mechanically supports and electrically connects electrical or electronic components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Components are generally soldered onto the PCB to both electrically connect and mechanically fasten them to it.PCBs can be single-sided (one copper layer), double-sided (two copper layers on both sides of one substrate layer), or multi-layer (outer and inner layers of copper, alternating with layers of substrate). Multi-layer PCBs allow for much higher component density, because circuit traces on the inner layers would otherwise take up surface space between components. The rise in popularity of multilayer PCBs with more than two, and especially with more than four, copper planes was concurrent with the adoption of surface mount technology.
What is the difference between a Countersink and a Counterbore?
Kemampuan manufaktur PCB YMS Normal:
| Gambaran umum kapabilitas manufaktur PCB YMS Normal | ||
| Fitur | kemampuan | |
| Jumlah Lapisan | 1-60L | |
| Tersedia Teknologi PCB Normal | Lubang tembus dengan Rasio Aspek 16: 1 | |
| terkubur dan buta melalui | ||
| Hibrida | Bahan Frekuensi Tinggi seperti RO4350B dan FR4 Mix dll. | |
| Bahan Berkecepatan Tinggi seperti M7NE dan FR4 Mix dll. | ||
| Bahan | CEM- | CEM-1; CEM-2 ； CEM-4 ； CEM-5. dll |
| FR4 | EM827, 370HR, S1000-2, IT180A, IT158, S1000 / S1155, R1566W, EM285, TU862HF, NP170G dll. | |
| Kecepatan tinggi | Megtron6, Megtron4, Megtron7, TU872SLK, FR408HR, N4000-13 Series, MW4000, MW2000, TU933 dll. | |
| Frekuensi tinggi | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 dll. | |
| Lainnya | Polimida, Tk, LCP, BT, C-ply, Fradflex, Omega, ZBC2000, PEEK, PTFE, berbasis keramik, dll. | |
| Ketebalan | 0,3 mm-8 mm | |
| Ketebalan Max.copper | 10 OZ | |
| Lebar dan Spasi Garis Minimum | 0.05mm / 0.05mm (2mil / 2mil) | |
| BGA PITCH | 0,35 mm | |
| Ukuran Bor mekanik Min | 0,15 mm (6mil) | |
| Rasio Aspek untuk lubang tembus | 16 ： 1 | |
| Permukaan Selesai | HASL, HASL bebas timah, ENIG, Timah Perendaman, OSP, Perak Perendaman, Jari Emas, Emas Keras Elektroplating, OSP Selektif, ENEPIG.etc. | |
| Melalui Opsi Isi | The via dilapisi dan diisi dengan epoksi konduktif atau non-konduktif kemudian ditutup dan dilapisi (VIPPO) | |
| Isi tembaga, isi perak | ||
| Registrasi | ± 4mil | |
| Topeng solder | Hijau, Merah, Kuning, Biru, Putih, Hitam, Ungu, Matte Black, Matte green. Dll. | |
Kamu mungkin suka:
1、Summary of matters needing attention in circuit board welding
4、Apa itu pengujian papan telanjang?
5. Apa itu desain PCB frekuensi tinggi?
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