Double sided pcb Normal pcb Lead free HASL Counterbore Manufacturer | YMS PCB
HAL(Lead Free), the full name is Hot Air leveling with Lead Free. Compared with HASL, the main difference for HAL(Lead Free) is the element of material which do not contain Lead(Pb), so it’s RoHS Compliant and it’s much more popular and widely used in pembuatan PCB .
HAL(Lead Free) requires higher run temperatures for lead free solder and longer contact time, the production cost for HAL(Lead Free) is slightly higher than HASL(Tin/Lead).
The manufacturing process of HAL(Lead Free) is similar to HASL(Tin/Lead), the circuit boards will be submersed in molten solder(Lead Free). This solder will cover all the exposed copper surfaces. Upon retraction from the solder, high pressure hot air is blown over the surface through air knives, this levels the solder deposit and removes the excess solder from the surface of printed circuit boards.
Pengenalan Papan Litar Bercetak
Papan Litar Bercetak Biasa: Most PCBs for simple electronics are simple and composed of only a single layer. More sophisticated hardware such as computer graphics cards or motherboards can have 2 or multiple layers, sometimes up to twelve.
A printed circuit board (PCB) mechanically supports and electrically connects electrical or electronic components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Components are generally soldered onto the PCB to both electrically connect and mechanically fasten them to it.PCBs can be single-sided (one copper layer), double-sided (two copper layers on both sides of one substrate layer), or multi-layer (outer and inner layers of copper, alternating with layers of substrate). Multi-layer PCBs allow for much higher component density, because circuit traces on the inner layers would otherwise take up surface space between components. The rise in popularity of multilayer PCBs with more than two, and especially with more than four, copper planes was concurrent with the adoption of surface mount technology.
What is the difference between a Countersink and a Counterbore?
Keupayaan pembuatan PCB YMS Normal:
| Gambaran keseluruhan keupayaan pembuatan PCB YMS Normal | ||
| Ciri | kemampuan | |
| Kiraan Lapisan | 1-60L | |
| Teknologi PCB Normal yang ada | Melalui lubang dengan Nisbah Aspek 16: 1 | |
| terkubur dan buta melalui | ||
| Hibrid | Bahan Frekuensi Tinggi seperti RO4350B dan FR4 Mix dll. | |
| Bahan Berkelajuan Tinggi seperti M7NE dan FR4 Mix dll. | ||
| Bahan | CEM- | CEM-1; CEM-2 ； CEM-4 ； CEM-5.etc |
| FR4 | EM827, 370HR, S1000-2, IT180A, IT158, S1000 / S1155, R1566W, EM285, TU862HF, NP170G dll. | |
| Kelajuan tinggi | Megtron6, Megtron4, Megtron7, TU872SLK, FR408HR, N4000-13 Series, MW4000, MW2000, TU933 dll. | |
| Berfrekuensi tinggi | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 dll. | |
| Yang lain | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega, ZBC2000, PEEK, PTFE, berasaskan seramik dll. | |
| Ketebalan | 0.3mm-8mm | |
| Ketebalan Max.copper | 10OZ | |
| Lebar dan Ruang Garisan minimum | 0.05mm / 0.05mm (2mil / 2mil) | |
| BGA PITCH | 0.35mm | |
| Saiz Penggerudian Min mekanikal | 0.15mm (6 juta) | |
| Nisbah Aspek untuk lubang melalui | 16 ： 1 | |
| Kemasan Permukaan | HASL, HASL bebas timbal, ENIG, Timah rendaman, OSP, Perak rendaman, Jari emas, Emas keras penyaduran, OSP terpilih ， ENEPIG.etc. | |
| Melalui Pilihan Isi | Jalur dilapisi dan diisi dengan epoksi konduktif atau tidak konduktif kemudian ditutup dan disalut (VIPPO) | |
| Tembaga diisi, perak diisi | ||
| Pendaftaran | ± 4 juta | |
| Topeng Pateri | Hijau, Merah, Kuning, Biru, Putih, Hitam, Ungu, Matte Hitam, Matte hijau.etc. | |
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