High Tg PCB Advanced PCB Manufacturing| YMS PCB

Penerangan Ringkas:

High-TG-Material start at around TG of 170°C. Most high-TG materials up to TG170°C are based on FR4 fibre-glass/epoxy compounds and are produced and processed like standard PCBs.

Parameter

Layers: 4L High Tg FR4 Material

Pemikiran Papan: 1.6mm

Base Material:EM827 High tg

Lubang Min: 0.2mm

Lebar / Pelepasan Garis Minimum: 0.075mm / 0.075mm

Pelepasan minimum antara Lapisan Dalam PTH ke Garis: 0.2mm

Size：208mm×148mm

Nisbah aspek: 8: 1

Surface treatment：Lead free HASL

Single-sided impedance 55Ω±10%, Differential impedance 100+7/-8Ω

Applications: Consumer electronics

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Detail produk

produk Tags

How do I classify high-TG materials?

Bahan	TG	MOT
FR4-standard-TG	130°C	110°C
FR4-mittel-TG	150°C	130°C
FR4-hoch-TG	170°C	150°C
Polyimid-Super-hoch-TG-Material	250°C	230°C

ome common high-frequency materials do not mention TGs in their datasheets. This is due to the original meaning of TG: "temperature of glass transition". Many ceramics- or PTFE-based materials do simply not contain any glass fibres and therefore have no technical TG. Generally, this fact also applies to Polyimides (PI). However, you can usually assume a TG of at least 200°C for Polyimide, ceramics or PTFE-materials. In this case the TG simply stands for temperature resistance.

You may apply the following values:

Material type	Typical „TG“
CEM1	110-130°C
FR4	120-180°C
PTFE	200-260°C
Ceramic	200-300°C
Polyimide	200-350°C

YMS High Tg PCB manufacturing capabilities:

YMS High Tg PCB manufacturing capabilities overview
Ciri	kemampuan
Kiraan Lapisan	3-60L
Teknologi PCB Multilayer yang ada	Melalui lubang dengan Nisbah Aspek 16: 1
	terkubur dan buta melalui
	Hibrid	High Frequency Material such as RO4350B and FR4 TG 180°Mix etc.
		High Speed Material such as M7NE and FR4 TG 180°Mix etc.
Ketebalan	0.3mm-8mm
Lebar dan Ruang Garisan minimum	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0.35mm
Saiz Penggerudian Min mekanikal	0.15mm (6 juta)
Nisbah Aspek untuk lubang melalui	16: 1
Kemasan Permukaan	HASL, HASL bebas timbal, ENIG, Timah rendaman, OSP, Perak rendaman, Jari emas, Emas keras penyaduran, OSP terpilih ， ENEPIG.etc.
Melalui Pilihan Isi	Jalur dilapisi dan diisi dengan epoksi konduktif atau tidak konduktif kemudian ditutup dan disalut (VIPPO)
	Tembaga diisi, perak diisi
Pendaftaran	± 4 juta
Topeng Pateri	Hijau, Merah, Kuning, Biru, Putih, Hitam, Ungu, Matte Hitam, Matte hijau.etc.