High Tg PCB Advanced PCB Manufacturing| YMS PCB

Pōkole Description:

High-TG-Material start at around TG of 170°C. Most high-TG materials up to TG170°C are based on FR4 fibre-glass/epoxy compounds and are produced and processed like standard PCBs.

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Layers: 4L High Tg FR4 Material

Manaʻo Papa: 1.6mm

Base Material:EM827 High tg

Nā Lā Min: 0.2mm

Ka Laina Laina / ʻĀina: 0.075mm / 0.075mm

Ka ʻoluʻolu liʻiliʻi ma waena o ka papa o ka hohonu PTH i ka laina: 0.2mm

Size：208mm×148mm

Lākiō hiʻohiʻona: 8: 1

Surface treatment：Lead free HASL

Single-sided impedance 55Ω±10%, Differential impedance 100+7/-8Ω

Applications: Consumer electronics

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How do I classify high-TG materials?

Mea Pono	TG	MOT
FR4-standard-TG	130°C	110°C
FR4-mittel-TG	150°C	130°C
FR4-hoch-TG	170°C	150°C
Polyimid-Super-hoch-TG-Material	250°C	230°C

ome common high-frequency materials do not mention TGs in their datasheets. This is due to the original meaning of TG: "temperature of glass transition". Many ceramics- or PTFE-based materials do simply not contain any glass fibres and therefore have no technical TG. Generally, this fact also applies to Polyimides (PI). However, you can usually assume a TG of at least 200°C for Polyimide, ceramics or PTFE-materials. In this case the TG simply stands for temperature resistance.

You may apply the following values:

Material type	Typical „TG“
CEM1	110-130°C
FR4	120-180°C
PTFE	200-260°C
Ceramic	200-300°C
Polyimide	200-350°C

YMS High Tg PCB manufacturing capabilities:

YMS High Tg PCB manufacturing capabilities overview
Hiʻona	nā hiki
Helu Layer	3-60L
Loaʻa ka ʻenehana PCB Multilayer	Ma o ka lua me Aspect Ratio 16: 1
	kanu ʻia a makapō ma
	ʻano huila	High Frequency Material such as RO4350B and FR4 TG 180°Mix etc.
		High Speed Material such as M7NE and FR4 TG 180°Mix etc.
Mānoanoa	0.3mm-8mm
Ka laina liʻiliʻi loa a me ka lewa	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0.35mm
Min mīkini ʻeli ka nui	0.15mm (6mil)
Lākiō hiʻohiʻona no ma o ka puka	16: 1
ʻIli Pau	HASL, Alakai manuahi HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP, ENEPIG.etc.
Via Hoʻopiha Hoʻopiha	Hoʻopili ʻia ka via a hoʻopihapiha ʻia me kekahi epoxy conductive a i ʻole non-conductive a laila kāpili ʻia a plated ma luna (VIPPO)
	Piha keleawe, hoʻopiha kālā
Kakau inoa	± 4milā
Makakiʻi paukū	ʻŌmaʻomaʻo, ʻulaʻula, melemele, polū, keʻokeʻo, ʻeleʻele, poni, Matte ʻeleʻele, Matte ʻōmaʻomaʻo.