High Tg PCB Advanced PCB Manufacturing| YMS PCB

Breve descrizzione:

High-TG-Material start at around TG of 170°C. Most high-TG materials up to TG170°C are based on FR4 fibre-glass/epoxy compounds and are produced and processed like standard PCBs.

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Layers: 4L High Tg FR4 Material

Pensamentu di u Cunsigliu: 1.6mm

Base Material:EM827 High tg

Fori minimi: 0,2 mm

Larghezza Minima di Linea / Liquidazione ： 0.075mm / 0.075mm

Distanza Minima trà PTH di Stratu Internu à Linea ： 0.2mm

Size：208mm×148mm

Inquadramentu aspettu: 8: 1

Surface treatment：Lead free HASL

Single-sided impedance 55Ω±10%, Differential impedance 100+7/-8Ω

Applications: Consumer electronics

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How do I classify high-TG materials?

Materiale	TG	MOT
FR4-standard-TG	130°C	110°C
FR4-mittel-TG	150°C	130°C
FR4-hoch-TG	170°C	150°C
Polyimid-Super-hoch-TG-Material	250°C	230°C

ome common high-frequency materials do not mention TGs in their datasheets. This is due to the original meaning of TG: "temperature of glass transition". Many ceramics- or PTFE-based materials do simply not contain any glass fibres and therefore have no technical TG. Generally, this fact also applies to Polyimides (PI). However, you can usually assume a TG of at least 200°C for Polyimide, ceramics or PTFE-materials. In this case the TG simply stands for temperature resistance.

You may apply the following values:

Material type	Typical „TG“
CEM1	110-130°C
FR4	120-180°C
PTFE	200-260°C
Ceramic	200-300°C
Polyimide	200-350°C

YMS High Tg PCB manufacturing capabilities:

YMS High Tg PCB manufacturing capabilities overview
Feature	capacità
Conti di Livelli	3-60L
Tecnulugia PCB Multilayer dispunibule	Foru attraversu cù Proporzione 16: 1
	sipoltu è cecu via
	Ibridu	High Frequency Material such as RO4350B and FR4 TG 180°Mix etc.
		High Speed Material such as M7NE and FR4 TG 180°Mix etc.
Spessore	0,3 mm-8 mm
Larghezza minima di linea è Spaziu	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0,35 mm
Dimensione minima forata meccanica	0.15mm (6mil)
Ratio d'aspettu per u foru passante	16: 1
Finitura superficiale	HASL, HASL senza piombu, ENIG, Stagnu à immersione, OSP, Argentu à immersione, Dita d'oru, Galvanoplastia Duro Duro, OSP selettivu E ENEPIG.etc.
Via Opzione Fill	A via hè placcata è piena di epossidia cunduttiva o non conduttiva poi tappata è placcata (VIPPO)
	Rame pienu, argentu pienu
Scrizzione	± 4mil
Maschera di Saldatura	Verde, Rossu, Giallu, Turchinu, Biancu, Neru, Viulettu, Neru Matteu, verde Matteu ecc.