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High Tg PCB Advanced PCB Manufacturing| YMS PCB

Description:

High-TG-Material start at around TG of 170°C. Most high-TG materials up to TG170°C are based on FR4 fibre-glass/epoxy compounds and are produced and processed like standard PCBs. 

Morbi

Layers: 4L High Tg FR4 Material

Tabula Thinkness: 1.6mm

Base Material:EM827 High tg

Min egréssus: 0.2mm

Minimum line width / Clearance: 0.075mm / 0.075mm

Stratum PTH ad interiora minimam inter lineam Clearance: 0.2mm

Size:208mm×148mm

Aspect Ratio: VIII: I

Surface treatment:Lead free HASL

Single-sided impedance 55Ω±10%, Differential impedance 100+7/-8Ω

Applications: Consumer electronics


Product Detail

Product Tags

How do I classify high-TG materials?

material TG MOT
FR4-standard-TG 130°C 110°C
FR4-mittel-TG 150°C 130°C
FR4-hoch-TG 170°C 150°C
Polyimid-Super-hoch-TG-Material 250°C 230°C

ome common high-frequency materials do not mention TGs in their datasheets. This is due to the original meaning of TG: "temperature of glass transition". Many ceramics- or PTFE-based materials do simply not contain any glass fibres and therefore have no technical TG. Generally, this fact also applies to Polyimides (PI). However, you can usually assume a TG of at least 200°C for Polyimide, ceramics or PTFE-materials. In this case the TG simply stands for temperature resistance. 

You may apply the following values:

Material type Typical „TG“
CEM1 110-130°C
FR4 120-180°C
PTFE 200-260°C
Ceramic 200-300°C
Polyimide 200-350°C

YMS High Tg PCB manufacturing capabilities:

YMS High Tg PCB manufacturing capabilities overview

feature facultatem
stratum comitis 3-60L
Available multilayer PCB Technology Et per foraminis Aspect Ratio XVI: I
et per buried cæcus
hybrid High Frequency Material such as RO4350B and FR4 TG 180°Mix  etc.
High Speed Material such as M7NE and FR4 TG 180°Mix   etc.
crassitudine 0.3mm, 8mm
Vivamus ipsum aciem spatium minimum 0.05mm / 0.05mm (2mil / 2mil)
BGA CASTRA 0.35mm
Min Location mechanica Drilled 0.15mm (6mil)
Aspect Ratio enim per foraminis XVI: I
Conclusio superficiem Removerit, removerit Category: enig, immersionis Stannum OSP immersionis argenti Digitus Aurum, Aurum Puer electroplating, electionem selectivam OSP ENEPIG.etc.
Via Bene Reple Et per hoc in patella repleti PROLIXUS vel epoxy erit PROLIXUS vel non-capped et super patella (VIPPO)
Aere impleta implebitur pecunia
Registration ± 4mil
Os solidaturam Viridis, Red, Yellow, cæruleus, albus, Nigrum, Purple, Matte Nigrum, Matte green.etc.

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https://www.ymspcb.com/4layer-high-tg-board.html



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