High Tg PCB Advanced PCB Manufacturing| YMS PCB

Kort beskrivelse:

High-TG-Material start at around TG of 170°C. Most high-TG materials up to TG170°C are based on FR4 fibre-glass/epoxy compounds and are produced and processed like standard PCBs.

Parametre

Layers: 4L High Tg FR4 Material

Board Thinkness: 1,6 mm

Base Material:EM827 High tg

Min. Huller: 0,2 mm

Minimum linjebredde / -afstand ： 0,075 mm / 0,075 mm

Minimumsafstand mellem det indre lag PTH til linjen ： 0,2 mm

Size：208mm×148mm

Aspekt Ratio: 8: 1

Surface treatment：Lead free HASL

Single-sided impedance 55Ω±10%, Differential impedance 100+7/-8Ω

Applications: Consumer electronics

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Produkt detaljer

Tags på produkter

How do I classify high-TG materials?

Materiale	TG	MOT
FR4-standard-TG	130°C	110°C
FR4-mittel-TG	150°C	130°C
FR4-hoch-TG	170°C	150°C
Polyimid-Super-hoch-TG-Material	250°C	230°C

ome common high-frequency materials do not mention TGs in their datasheets. This is due to the original meaning of TG: "temperature of glass transition". Many ceramics- or PTFE-based materials do simply not contain any glass fibres and therefore have no technical TG. Generally, this fact also applies to Polyimides (PI). However, you can usually assume a TG of at least 200°C for Polyimide, ceramics or PTFE-materials. In this case the TG simply stands for temperature resistance.

You may apply the following values:

Material type	Typical „TG“
CEM1	110-130°C
FR4	120-180°C
PTFE	200-260°C
Ceramic	200-300°C
Polyimide	200-350°C

YMS High Tg PCB manufacturing capabilities:

YMS High Tg PCB manufacturing capabilities overview
Funktion	kapaciteter
Lagantal	3-60L
Tilgængelig flerlags printkortteknologi	Gennemgående hul med billedformat 16: 1
	begravet og blind via
	Hybrid	High Frequency Material such as RO4350B and FR4 TG 180°Mix etc.
		High Speed Material such as M7NE and FR4 TG 180°Mix etc.
Tykkelse	0,3 mm-8 mm
Minimum linjebredde og mellemrum	0,05 mm / 0,05 mm (2 mil / 2 mil)
BGA Pitch	0,35 mm
Min mekanisk boret størrelse	0,15 mm (6mil)
Billedformat for gennemgående hul	16: 1
Overfladebehandling	HASL, Blyfri HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP ， ENEPIG.etc.
Via udfyldningsmulighed	Via er udpladet og fyldt med enten ledende eller ikke-ledende epoxy, derefter lukket og belagt over (VIPPO)
	Kobberfyldt, sølvfyldt
Registrering	± 4mil
Loddemaske	Grøn, rød, gul, blå, hvid, sort, lilla, mat sort, mat grøn. Osv.