High Tg PCB Advanced PCB Manufacturing| YMS PCB

Korte beschrijving:

High-TG-Material start at around TG of 170°C. Most high-TG materials up to TG170°C are based on FR4 fibre-glass/epoxy compounds and are produced and processed like standard PCBs.

parameters

Layers: 4L High Tg FR4 Material

Board Thinkness: 1,6 mm

Base Material:EM827 High tg

Min gaten: 0,2 mm

Minimale lijnbreedte / speling: 0,075 mm / 0,075 mm

Minimale afstand tussen binnenste laag PTH tot lijn: 0,2 mm

Size：208mm×148mm

Aspect Ratio: 8: 1

Surface treatment：Lead free HASL

Single-sided impedance 55Ω±10%, Differential impedance 100+7/-8Ω

Applications: Consumer electronics

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Product detail

product Tags

How do I classify high-TG materials?

Materiaal	TG	MOT
FR4-standard-TG	130°C	110°C
FR4-mittel-TG	150°C	130°C
FR4-hoch-TG	170°C	150°C
Polyimid-Super-hoch-TG-Material	250°C	230°C

ome common high-frequency materials do not mention TGs in their datasheets. This is due to the original meaning of TG: "temperature of glass transition". Many ceramics- or PTFE-based materials do simply not contain any glass fibres and therefore have no technical TG. Generally, this fact also applies to Polyimides (PI). However, you can usually assume a TG of at least 200°C for Polyimide, ceramics or PTFE-materials. In this case the TG simply stands for temperature resistance.

You may apply the following values:

Material type	Typical „TG“
CEM1	110-130°C
FR4	120-180°C
PTFE	200-260°C
Ceramic	200-300°C
Polyimide	200-350°C

YMS High Tg PCB manufacturing capabilities:

YMS High Tg PCB manufacturing capabilities overview
Voorzien zijn van	mogelijkheden
Aantal lagen	3-60L
Beschikbare meerlagige PCB-technologie	Doorgaand gat met beeldverhouding 16: 1
	begraven en blind via
	Hybride	High Frequency Material such as RO4350B and FR4 TG 180°Mix etc.
		High Speed Material such as M7NE and FR4 TG 180°Mix etc.
Dikte	0,3 mm-8 mm
Minimale lijnbreedte en spatie	0,05 mm / 0,05 mm (2 mil / 2 mil)
BGA PLAATS	0,35 mm
Min mechanisch geboorde maat	0,15 mm (6 mil)
Aspect Ratio voor doorlopend gat	16: 1
Oppervlakteafwerking	HASL, loodvrij HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP, ENEPIG. Enz.
Via vuloptie	De via is geplateerd en gevuld met geleidende of niet-geleidende epoxy en vervolgens afgedekt en bedekt (VIPPO)
	Koper gevuld, zilver gevuld
Registratie	± 4mil
Soldeer masker	Groen, rood, geel, blauw, wit, zwart, paars, matzwart, matgroen. Enz.