China Manufacturer for China Professional HDI Supplier High Tg PCB Circuit Board Multilayer Buried and Blind Via Holes PCB with RoHS

Short Description:

HDI printed circuit boards offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

Parameters

Layers: 12

Base Material:FR4 High Tg EM827

Thickness：1.2±0.1mm

Min.Hole Size：0.15mm

Minimum Line Width/Space：0.075mm/0.075mm

Minimum Clearance between Inner Layer PTH and Line： 0.2mm

Size：101mm×55mm

Aspect Ratio：8 : 1

Surface treatment：ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Blind Via and Buried Hole

Applications:Telecommunication

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We believe in: Innovation is our soul and spirit. High-quality is our life. Purchaser need is our God for China Manufacturer for China Professional HDI Supplier High Tg PCB Circuit Board Multilayer Buried and Blind Via Holes PCB with RoHS, Our aim is to help customers realize their goals. We are making great efforts to achieve this win-win situation and sincerely welcome you to join us.
We believe in: Innovation is our soul and spirit. High-quality is our life. Purchaser need is our God for China Printed Circuit Board, Fpc, We integrate design, manufacture and export together with more than 100 skillful workers, strict quality controlling system and experienced technology.We keep long term business relationships with wholesaler and distributors form more than 50 countries, such as USA, UK, Canada, Europe and Africa etc.

What is HDI PCBs?

High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market. Because of its higher circuitry density, the HDI PCB design can incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities. A high-density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.

1.Multi-step HDI enables the connection between any layers;

2.Cross-layer laser processing can enhance the quality level of multi-step HDI;

3.The combination of HDI and high-frequency materials, metal-based laminates, FPC and other special laminates and processes enable the needs of high density and high frequency, high heat conducting, or 3D assembly.

YMS HDI PCB manufacturing capabilities:

YMS HDI PCB manufacturing capabilities overview
Feature	capabilities
Layer Count	4-60L
Available HDI PCB Technology	1+N+1
	2+N+2
	3+N+3
	4+N+4
	5+N+5
	Any layer
Thickness	0.3mm-6mm
Minimum line Width and Space	0.05mm/0.05mm(2mil/2mil)
BGA PITCH	0.35mm
Min laser Drilled Size	0.075mm(3nil)
Min mechanical Drilled Size	0.15mm(6mil)
Aspect Ratio for laser hole	0.9:1
Aspect Ratio for through hole	16:1
Surface Finish	HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP，ENEPIG.etc.
Via Fill Option	The via is plated and filled with either conductive or non-conductive epoxy then capped and plated over
	Copper filled, silver filled
	Laser via copper plated shut
Registration	±4mil
Solder Mask	Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc.