High Tg PCB Advanced PCB Manufacturing| YMS PCB

Kuerz Beschreiwung:

High-TG-Material start at around TG of 170°C. Most high-TG materials up to TG170°C are based on FR4 fibre-glass/epoxy compounds and are produced and processed like standard PCBs.

Parameteren

Layers: 4L High Tg FR4 Material

Board Thinkness: 1,6 mm

Base Material:EM827 High tg

Min Lächer: 0.2mm

Minimum Linn Breet / Clearance ： 0.075mm / 0.075mm

Mindest Clearance tëscht banneschter Schicht PTH bis Linn ： 0.2mm

Size：208mm×148mm

Aspekt Verhältnis: 8: 1

Surface treatment：Lead free HASL

Single-sided impedance 55Ω±10%, Differential impedance 100+7/-8Ω

Applications: Consumer electronics

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Produit Gouschteng:

Produit Tags

How do I classify high-TG materials?

Material	TG	MOT
FR4-standard-TG	130°C	110°C
FR4-mittel-TG	150°C	130°C
FR4-hoch-TG	170°C	150°C
Polyimid-Super-hoch-TG-Material	250°C	230°C

ome common high-frequency materials do not mention TGs in their datasheets. This is due to the original meaning of TG: "temperature of glass transition". Many ceramics- or PTFE-based materials do simply not contain any glass fibres and therefore have no technical TG. Generally, this fact also applies to Polyimides (PI). However, you can usually assume a TG of at least 200°C for Polyimide, ceramics or PTFE-materials. In this case the TG simply stands for temperature resistance.

You may apply the following values:

Material type	Typical „TG“
CEM1	110-130°C
FR4	120-180°C
PTFE	200-260°C
Ceramic	200-300°C
Polyimide	200-350°C

YMS High Tg PCB manufacturing capabilities:

YMS High Tg PCB manufacturing capabilities overview
Fonktioun	Fäegkeeten
Schicht Grof	3-60L
Verfügbar Multilayer PCB Technologie	Duerch Lach mat Aspekt Verhältnis 16: 1
	begruewen a blann via
	Hybrid	High Frequency Material such as RO4350B and FR4 TG 180°Mix etc.
		High Speed Material such as M7NE and FR4 TG 180°Mix etc.
Déck	0,3 mm-8 mm
Minimum Linn Breet a Weltraum	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0,35mm
Min mechanesch Boormooss	0.15mm (6mil)
Aspekt Verhältnis fir duerch Lach	16: 1
Uewerfläch fäerdeg	HASL, Bläifräien HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Galvaniséierung Hard Gold, Selektiv OSP ， ENEPIG.etc.
Iwwer Fill Optioun	De via gëtt plated a mat entweder leitend oder net-leitend Epoxy gefëllt, duerno ofgedeckt a plated (VIPPO)
	Kupfer gefëllt, sëlwer gefëllt
Umeldung	± 4mil
Solder Mask	Gréng, Rout, Giel, Blo, Wäiss, Schwaarz, Purpur, Matt Schwaarz, Matt Gréng.