High Tg PCB Advanced PCB Manufacturing| YMS PCB

Katrangan singkat:

High-TG-Material start at around TG of 170°C. Most high-TG materials up to TG170°C are based on FR4 fibre-glass/epoxy compounds and are produced and processed like standard PCBs.

paramèter

Layers: 4L High Tg FR4 Material

Pikiran Papan: 1.6mm

Base Material:EM827 High tg

Bolongan Min: 0,2mm

Jembar / reresik garis minimal: 0,075mm / 0,075mm

Reresik Minimal ing antarane Lapisan Inner PTH nganti Line ： 0,2mm

Size：208mm×148mm

Aspek: 8: 1

Surface treatment：Lead free HASL

Single-sided impedance 55Ω±10%, Differential impedance 100+7/-8Ω

Applications: Consumer electronics

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Detail produk

Tags Product

How do I classify high-TG materials?

Materi	TG	MOT
FR4-standard-TG	130°C	110°C
FR4-mittel-TG	150°C	130°C
FR4-hoch-TG	170°C	150°C
Polyimid-Super-hoch-TG-Material	250°C	230°C

ome common high-frequency materials do not mention TGs in their datasheets. This is due to the original meaning of TG: "temperature of glass transition". Many ceramics- or PTFE-based materials do simply not contain any glass fibres and therefore have no technical TG. Generally, this fact also applies to Polyimides (PI). However, you can usually assume a TG of at least 200°C for Polyimide, ceramics or PTFE-materials. In this case the TG simply stands for temperature resistance.

You may apply the following values:

Material type	Typical „TG“
CEM1	110-130°C
FR4	120-180°C
PTFE	200-260°C
Ceramic	200-300°C
Polyimide	200-350°C

YMS High Tg PCB manufacturing capabilities:

YMS High Tg PCB manufacturing capabilities overview
Fitur	kapabilitas
Count Layer	3-60L
Kasedhiya Teknologi PCB Multilayer	Liwat bolongan kanthi Aspek Rasio 16: 1
	dikubur lan wuta liwat
	Hibrida	High Frequency Material such as RO4350B and FR4 TG 180°Mix etc.
		High Speed Material such as M7NE and FR4 TG 180°Mix etc.
Kandel	0.3mm-8mm
Jembar lan Spasi baris minimal	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0,35mm
Ukuran Bor Min mekanis	0.15mm (6mil)
Rasio Aspek liwat bolongan	16: 1
Lumahing Rampung	HASL, HASL, timah gratis, ENG, Timah, OSP, Silver Immersion, Driji Emas, Gold Hard Electroplating, OSP Selektif, ENEPIG.etc.
Liwat Isi Isi	Via dilapisi lan diisi epoxy konduktif utawa non-konduktif banjur ditutup lan dilapisi (VIPPO)
	Isi tembaga, perak isi
Registrasi	± 4mil
Topeng Solder	Ijo, Abang, Kuning, Biru, Putih, Ireng, Ungu, Matte Ireng, Matte ijo.