High Tg PCB Advanced PCB Manufacturing| YMS PCB

Kort beskrivelse:

High-TG-Material start at around TG of 170°C. Most high-TG materials up to TG170°C are based on FR4 fibre-glass/epoxy compounds and are produced and processed like standard PCBs.

parametere

Layers: 4L High Tg FR4 Material

Board Thinkness: 1,6 mm

Base Material:EM827 High tg

Min. Hull: 0,2 mm

Minimum linjebredde / klaring ： 0,075 mm / 0,075 mm

Minimumsavstand mellom indre lag PTH til linje ： 0,2 mm

Size：208mm×148mm

Sideforhold: 8: 1

Surface treatment：Lead free HASL

Single-sided impedance 55Ω±10%, Differential impedance 100+7/-8Ω

Applications: Consumer electronics

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Produkt detalj

produkt~~POS=TRUNC

How do I classify high-TG materials?

Materiale	TG	MOT
FR4-standard-TG	130°C	110°C
FR4-mittel-TG	150°C	130°C
FR4-hoch-TG	170°C	150°C
Polyimid-Super-hoch-TG-Material	250°C	230°C

ome common high-frequency materials do not mention TGs in their datasheets. This is due to the original meaning of TG: "temperature of glass transition". Many ceramics- or PTFE-based materials do simply not contain any glass fibres and therefore have no technical TG. Generally, this fact also applies to Polyimides (PI). However, you can usually assume a TG of at least 200°C for Polyimide, ceramics or PTFE-materials. In this case the TG simply stands for temperature resistance.

You may apply the following values:

Material type	Typical „TG“
CEM1	110-130°C
FR4	120-180°C
PTFE	200-260°C
Ceramic	200-300°C
Polyimide	200-350°C

YMS High Tg PCB manufacturing capabilities:

YMS High Tg PCB manufacturing capabilities overview
Trekk	evner
Lagtelling	3-60L
Tilgjengelig flerlags PCB-teknologi	Gjennomgående hull med bildeforhold 16: 1
	gravlagt og blind via
	Hybrid	High Frequency Material such as RO4350B and FR4 TG 180°Mix etc.
		High Speed Material such as M7NE and FR4 TG 180°Mix etc.
Tykkelse	0,3 mm-8 mm
Minimum linjebredde og mellomrom	0,05mm / 0,05mm (2mil / 2mil)
BGA PITCH	0,35 mm
Min mekanisk boret størrelse	0,15 mm (6mil)
Bildeforhold for gjennomgående hull	16: 1
Overflatebehandling	HASL, Blyfri HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP ， ENEPIG.etc.
Via Fill-alternativet	Via er belagt og fylt med enten ledende eller ikke-ledende epoksy, deretter dekket og belagt over (VIPPO)
	Kobberfylt, sølvfylt
Registrering	± 4mil
Loddemaske	Grønn, Rød, Gul, Blå, Hvit, Svart, Lilla, Matt Svart, Matt Grønn. Osv.