Top Suppliers China HDI PCB BGA

Short Description:

HDI PCBs are characterized by high-density attributes including laser microvias, fine lines and high performance thin materials.

Parameters

Layers: 10

Base Material:FR4 High Tg S1170

Thickness：1.6

Min Holes:0.2mm

Minimum Line Width/Clearance：0.075mm/0.075mm

Minimum Clearance between Inner Layer PTH and Line： 0.2mm

Size：100mm×100mm

Aspect Ratio：8 : 1

Surface treatment：ENIG

Differential impedance 100+7/-8Ω

Speciality: Laser via copper plated shut,VIPPO Technology

Applications:Communication

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We know that we only thrive if we will guarantee our combined cost competiveness and high-quality advantageous at the same time for Top Suppliers China HDI PCB BGA, Welcome to visit us at any time for organization marriage established.
We know that we only thrive if we will guarantee our combined cost competiveness and high-quality advantageous at the same time for China PCB Board, Printed Circuit Board, Our company has already had a lot of top factories and experienced technology teams in China, offering the best products, techniques and services to worldwide customers. Honesty is our principle, qualified operation is our work, service is our goal, and customers’ satisfaction is our future!

What is HDI PCB

HDI PCB: High density interconnect PCB, are a way of making more room on your printed circuit board to make them more efficient and allow for faster transmission. It’s relatively easy for most enterprising companies that are using printed circuit boards to see how this can benefit them.

Advantages of HDI PCB

The most common reason for using HDI technology is a significant increase in packaging density. The space obtained by finer track structures is available for components. Besides, overall space requirements are reduced will result in smaller board sizes and fewer layers.

Usually FPGA or BGA are available with 1mm or less spacing. HDI technology makes routing and connection easy, especially when routing between pins.

YMS HDI PCB manufacturing capabilities:

YMS HDI PCB manufacturing capabilities overview
Feature	capabilities
Layer Count	4-60L
Available HDI PCB Technology	1+N+1
	2+N+2
	3+N+3
	4+N+4
	5+N+5
	Any layer
Thickness	0.3mm-6mm
Minimum line Width and Space	0.05mm/0.05mm(2mil/2mil)
BGA PITCH	0.35mm
Min laser Drilled Size	0.075mm(3nil)
Min mechanical Drilled Size	0.15mm(6mil)
Aspect Ratio for laser hole	0.9:1
Aspect Ratio for through hole	16:1
Surface Finish	HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP，ENEPIG.etc.
Via Fill Option	The via is plated and filled with either conductive or non-conductive epoxy then capped and plated over
	Copper filled, silver filled
	Laser via copper plated shut
Registration	±4mil
Solder Mask	Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc.