High Tg PCB Advanced PCB Manufacturing| YMS PCB

Deskripsi Singkat:

High-TG-Material start at around TG of 170°C. Most high-TG materials up to TG170°C are based on FR4 fibre-glass/epoxy compounds and are produced and processed like standard PCBs.

parameter

Layers: 4L High Tg FR4 Material

Pemikiran Papan: 1.6mm

Base Material:EM827 High tg

Lubang Min: 0.2mm

Lebar Garis Minimum / Jarak: 0.075mm / 0.075mm

Jarak Bebas Minimum antara Lapisan Dalam PTH ke Saluran ： 0.2mm

Size：208mm×148mm

Aspect Ratio: 8: 1

Surface treatment：Lead free HASL

Single-sided impedance 55Ω±10%, Differential impedance 100+7/-8Ω

Applications: Consumer electronics

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How do I classify high-TG materials?

Bahan	TG	MOT
FR4-standard-TG	130°C	110°C
FR4-mittel-TG	150°C	130°C
FR4-hoch-TG	170°C	150°C
Polyimid-Super-hoch-TG-Material	250°C	230°C

ome common high-frequency materials do not mention TGs in their datasheets. This is due to the original meaning of TG: "temperature of glass transition". Many ceramics- or PTFE-based materials do simply not contain any glass fibres and therefore have no technical TG. Generally, this fact also applies to Polyimides (PI). However, you can usually assume a TG of at least 200°C for Polyimide, ceramics or PTFE-materials. In this case the TG simply stands for temperature resistance.

You may apply the following values:

Material type	Typical „TG“
CEM1	110-130°C
FR4	120-180°C
PTFE	200-260°C
Ceramic	200-300°C
Polyimide	200-350°C

YMS High Tg PCB manufacturing capabilities:

YMS High Tg PCB manufacturing capabilities overview
Fitur	kemampuan
Jumlah Lapisan	3-60L
Tersedia Teknologi PCB Multilayer	Lubang tembus dengan Rasio Aspek 16: 1
	terkubur dan buta melalui
	Hibrida	High Frequency Material such as RO4350B and FR4 TG 180°Mix etc.
		High Speed Material such as M7NE and FR4 TG 180°Mix etc.
Ketebalan	0,3 mm-8 mm
Lebar dan Spasi Garis Minimum	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0,35 mm
Ukuran Bor mekanik Min	0,15 mm (6mil)
Rasio Aspek untuk lubang tembus	16: 1
Permukaan Selesai	HASL, HASL bebas timah, ENIG, Timah Perendaman, OSP, Perak Perendaman, Jari Emas, Emas Keras Elektroplating, OSP Selektif, ENEPIG.etc.
Melalui Opsi Isi	The via dilapisi dan diisi dengan epoksi konduktif atau non-konduktif kemudian ditutup dan dilapisi (VIPPO)
	Isi tembaga, isi perak
Registrasi	± 4mil
Topeng solder	Hijau, Merah, Kuning, Biru, Putih, Hitam, Ungu, Matte Black, Matte green. Dll.