Double sided pcb Normal pcb Lead free HASL Counterbore Manufacturer | YMS PCB
HAL(Lead Free), the full name is Hot Air leveling with Lead Free. Compared with HASL, the main difference for HAL(Lead Free) is the element of material which do not contain Lead(Pb), so it’s RoHS Compliant and it’s much more popular and widely used in pabrik PCB .
HAL(Lead Free) requires higher run temperatures for lead free solder and longer contact time, the production cost for HAL(Lead Free) is slightly higher than HASL(Tin/Lead).
The manufacturing process of HAL(Lead Free) is similar to HASL(Tin/Lead), the circuit boards will be submersed in molten solder(Lead Free). This solder will cover all the exposed copper surfaces. Upon retraction from the solder, high pressure hot air is blown over the surface through air knives, this levels the solder deposit and removes the excess solder from the surface of printed circuit boards.
Pambuka Papan Sirkuit Cetak
Papan Sirkuit Cetak Normal: Most PCBs for simple electronics are simple and composed of only a single layer. More sophisticated hardware such as computer graphics cards or motherboards can have 2 or multiple layers, sometimes up to twelve.
A printed circuit board (PCB) mechanically supports and electrically connects electrical or electronic components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Components are generally soldered onto the PCB to both electrically connect and mechanically fasten them to it.PCBs can be single-sided (one copper layer), double-sided (two copper layers on both sides of one substrate layer), or multi-layer (outer and inner layers of copper, alternating with layers of substrate). Multi-layer PCBs allow for much higher component density, because circuit traces on the inner layers would otherwise take up surface space between components. The rise in popularity of multilayer PCBs with more than two, and especially with more than four, copper planes was concurrent with the adoption of surface mount technology.
What is the difference between a Countersink and a Counterbore?
Kapabilitas pabrik PCB YMS Normal:
| Ringkesan Kapabilitas Manufaktur PCB Normal | ||
| Fitur | kapabilitas | |
| Count Layer | 1-60L | |
| Kasedhiya Teknologi PCB Normal | Liwat bolongan kanthi Aspek Rasio 16: 1 | |
| dikubur lan wuta liwat | ||
| Hibrida | Bahan Frekuensi Dhuwur kayata RO4350B lan FR4 Mix lsp. | |
| Materi Kacepetan Dhuwur kayata M7NE lan FR4 Mix lsp. | ||
| Materi | CEM- | CEM-1; CEM-2 ； CEM-4 ； CEM-5.sjb |
| FR4 | EM827, 370HR, S1000-2, IT180A, IT158, S1000 / S1155, R1566W, EM285, TU862HF, NP170G lsp. | |
| Kacepetan Dhuwur | Megtron6, Megtron4, Megtron7, TU872SLK, FR408HR, N4000-13 Series, MW4000, MW2000, TU933 lsp. | |
| frekuensi dhuwur | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 lsp. | |
| Liyane | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega, ZBC2000, PEEK, PTFE, basis keramik lsp. | |
| Kandel | 0.3mm-8mm | |
| Max.copper Kandel | 10 OZ | |
| Jembar lan Spasi baris minimal | 0.05mm / 0.05mm (2mil / 2mil) | |
| BGA PITCH | 0,35mm | |
| Ukuran Bor Min mekanis | 0.15mm (6mil) | |
| Rasio Aspek liwat bolongan | 16 ： 1 | |
| Lumahing Rampung | HASL, HASL, timah gratis, ENG, Timah, OSP, Silver Immersion, Driji Emas, Gold Hard Electroplating, OSP Selektif, ENEPIG.etc. | |
| Liwat Isi Isi | Via dilapisi lan diisi epoxy konduktif utawa non-konduktif banjur ditutup lan dilapisi (VIPPO) | |
| Isi tembaga, perak isi | ||
| Registrasi | ± 4mil | |
| Topeng Solder | Ijo, Abang, Kuning, Biru, Putih, Ireng, Ungu, Matte Ireng, Matte ijo. | |
Sampeyan Bisa Kaya:
1, Summary of matters needing attention in circuit board welding
3. What is PCB
5. Apa desain PCB frekuensi dhuwur
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