Double Layer PCB Countersink Halogen Free Material| YMS PCB

Short Description:

Double-sided PCBs are the same as single-sided PCBs, but the difference is they have two sided traces with a top and bottom layer. Double-sided PCBs can mount conductive copper and components on both sides of the printed circuit board so that the traces can cross over each other. So it leads to a higher density of boards without the need of point-to-point soldering. So it’s difficult to fabricate the double-sided PCBs because they are more complex than single-sided PCBs. However, it’s better to use the double-sided PCBs compared to single-sided PCBs.

Parameters

Layers: 2 Double sided PCB

Thickness:1.6mm

Base Material: S1150G Halogen Free

Mininum Hole Size：0.2mm

Minimum Line Width/Clearance：0.15mm/0.15mm

Size：250mm×180mm

Aspect Ratio：8 : 1

Surface treatment：ENIG

Special technique: Countersink

Applications:Main Board / Consumer electronics

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Product Detail

Product Tags

China two layer Fr4 PCB is one of the most popular types of PCBs because they make manufacturers to fabricate more complex circuits, which can benefit uses in higher technology applications and electronics. There is an abundance of applications and electronics which double sided PCBs can be used in electronics such as:LED lighting systems、Consumer Electronics.

What is the difference between a Countersink and a Counterbore?

YMS Normal PCB manufacturing capabilities:

YMS Normal PCB manufacturing capabilities overview
Feature	capabilities
Layer Count	1-60L
Available Normal PCB Technology	Through hole with Aspect Ratio 16:1
	buried and blind via
	Hybrid	High Frequency Material such as RO4350B and FR4 Mix etc.
		High Speed Material such as M7NE and FR4 Mix etc.
Material	CEM-	CEM-1;CEM-2；CEM-4；CEM-5.etc
	FR4	EM827, 370HR, S1000-2, IT180A, IT158, S1000 / S1155, R1566W, EM285, TU862HF,NP170G etc.
	High Speed	Megtron6, Megtron4, Megtron7,TU872SLK, FR408HR,N4000-13 Series,MW4000,MW2000,TU933 etc.
	High Frequency	Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 etc.
	Others	Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega , ZBC2000,PEEK,PTFE,ceramic-based etc.
Thickness	0.3mm-8mm
Max.copper Thickness	10OZ
Minimum line Width and Space	0.05mm/0.05mm(2mil/2mil)
BGA PITCH	0.35mm
Min mechanical Drilled Size	0.15mm(6mil)
Aspect Ratio for through hole	16：1
Surface Finish	HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP，ENEPIG.etc.
Via Fill Option	The via is plated and filled with either conductive or non-conductive epoxy then capped and plated over(VIPPO)
	Copper filled, silver filled
Registration	±4mil
Solder Mask	Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc.