High Tg material PCB 6 Layer High Tg Board| YMS PCB

Pondok Description:

High TG PCBs have an array of applications, from engines to industrial processes, WiFi boosters, and computer systems. They mitigate the internal damage a machine does to itself when it functions by raising the tolerance of a device to heat, moisture, and chemical corrosion. Not only do they improve functionality, but they also enhance the lifespan of PCBs in general by reducing common issues like short-circuiting. If you are looking to get the best-embedded systems or a high TG produsén PCB , look no further. You can use YMS technology to design your high TG PCB boards.

parameter

Layers: 6L High Tg FR4 Material Pikiran Papan: 1.6mm Base Material:EM827 High tg Liang Liang: 0.2mm Lebar Gariswanci minimum / Izin ： 0.075mm / 0.075mm Izin minimum antara Lapisan Batin PTH ka Garis ： 0.2mm Size：214mm×148mm Aspék Rasio: 8: 1 perlakuan beungeut: ENIG Single-sided impedance 55Ω±10%, Differential impedance 100+7/-8Ω Applications: Consumer electronics

Kirim surélék ka kami Ngundeur sakumaha PDF

jéntré produk

FAQ

Tags produk

High-TG PCB Advanced Circuits Specification

The glass transition temperature of PCB, referred to as "Tg", indicates the point at which the PCB material will begin to transform. If the operating temperature exceeds the designated Tg value, the board will begin to change from a solid to a liquid state, which is likely to have an adverse effect on its ability to function.

Standard PCBs are manufactured with materials offering a TG value of 140°C, which can withstand an operating temperate of 110°C. While this may not be suitable for extreme-temperature processes that are commonplace in applications such as automotive, industrial or high-temperature electronics. In these situations, a PCB made from FR-4 High TG material can often provide the best solution.

YMS High Tg PCB manufacturing capabilities:

YMS High Tg PCB manufacturing capabilities overview
Fitur	kamampuan
Lapisan Count	3-60L
Sadia Téhnologi PCB Multilayer	Ngalangkungan liang sareng Aspék Rasio 16: 1
	dikubur sareng buta via
	Hibrida	High Frequency Material such as RO4350B and FR4 TG 180°Mix etc.
		High Speed Material such as M7NE and FR4 TG 180°Mix etc.
Kandel	0.3mm-8mm
Lebar minimum sareng Spasi	0.05mm / 0.05mm (2mil / 2mil)
BGA PITCH	0,35 mm
Ukuran mékanis dibor mékanis	0.15mm (6mil)
Aspék Rasio pikeun liwat liang	16: 1
Permukaan Rengse	HASL, Lead gratis HASL, ENIG, Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP ， ENEPIG.etc.
Ngalangkungan Pilihan Eusian	Via dilapis sareng dieusi epoxy konduktif atanapi non-konduktif teras dicabok sareng dilapis (VIPPO)
	Tambaga dieusian, pérak dieusian
Pendaptaran	± 4mil
Masker Solder	Héjo, Beureum, Konéng, Biru, Bodas, Hideung, Ungu, Matte Hideung, Matte héjo. Sareng sajabana.