Ii-substrates zesekethe ezidityanisiweyo ziye zaduma kumaxesha amva nje. Kuye kwaba nesiphumo sokuvela kweentlobo zesekethe ezidibeneyo ezifana nephakheji ye-chip-scale (CSP) kunye ne-ball grid package (BGP). Iiphakheji ze-IC ezinjalo zibiza abathwali bepakethe yenoveli, into ephendulwa yi- IC substrate. Njengomyili wezinto zombane okanye injineli, ayisabonakali ngokwaneleyo ukuqonda ukubaluleka kwe-IC package substrate. Kufuneka uqonde inkqubo yokwenziwa kwe-IC substrate, indima edlalwa yi-ICs ye-substrate ekusebenzeni ngokufanelekileyo kombane, kunye neendawo zayo zokusebenza. I-IC substrate luhlobo lwebhodi yesiseko esetyenziselwa ukupakisha i-IC engenanto (integrate circuit) chip. Ukuqhagamshela itshiphu kunye nebhodi yesekethe, i-IC yeyemveliso ephakathi kunye nale misebenzi ilandelayo:

• ibamba isemiconductor IC chip;

• kukho indlela ngaphakathi ukuqhagamshela itshiphu kunye nePCB;

• inokukhusela, yomeleze kwaye ixhase i-IC chip, ibonelele ngetonela yokulahla i-thermal.

Iimpawu ze-IC Substrate

Iisekethe ezidibeneyo zineempawu ezininzi kunye nezahlukeneyo. Iquka oku kulandelayo.

Ukukhanya xa kufikwa kubunzima

Iingcingo zelothe ezimbalwa kunye namajoyinti athengiswayo

Ithembeke kakhulu

Ukusebenza okuphuculweyo xa ezinye iimpawu ezinjengokuthembeka, ukuqina, kunye nobunzima bubandakanyiwe

Ubungakanani obuncinci Yintoni ukuvumisa kwe-IC substrate ye-PCB?

I-IC substrate luhlobo lwebhodi yesiseko esetyenziselwa ukupakisha i-IC engenanto (i-integrate circuit) chip. Ukuqhagamshela itshiphu kunye nebhodi yesekethe, i-IC yeyemveliso ephakathi kunye nale misebenzi ilandelayo:

• ibamba isemiconductor IC chip;

• kukho indlela ngaphakathi ukuqhagamshela itshiphu kunye nePCB;

• inokukhusela, yomeleze kwaye ixhase i-IC chip, ibonelele ngetonela yokulahla i-thermal. 

Usetyenziso lwe-IC Substrate PCB

I-IC substrate PCBs isetyenziswa ikakhulu kwiimveliso zombane ezinobunzima obulula, ukubhitya kunye nemisebenzi eqhubela phambili, enjengee-smartphones, iilaptop, iPC yethebhulethi kunye nothungelwano kwiinkalo zonxibelelwano, ukhathalelo lwezonyango, ulawulo lwamashishini, i-aerospace kunye nomkhosi.

Ii-PCB eziqinileyo ziye zalandela ngokulandelelana kwezinto ezintsha ezivela kwi-PCB eninzi, ii-PCB zemveli ze-HDI, i-SLP (i-substrate-efana ne-PCB) ukuya kwi-IC substrate PCBs. I-SLP luhlobo nje lweePCB eziqinileyo ezinenkqubo yokwenziwa okufanayo malunga nesikali se-semiconductor.

UkuHlola ubuKhono kunye neTekhnoloji yoVavanyo lokuthembeka kweMveliso

I-IC substrate PCB ibiza izixhobo zokuhlola ezahlukileyo kwezo zisetyenziselwa i-PCB yemveli. Ukongeza, iinjineli kufuneka zibekhona ezikwaziyo ukwenza izakhono zokuhlola kwisixhobo esikhethekileyo.

Lilonke, i-IC substrate PCB ifuna imfuneko engaphezulu kune-PCB eqhelekileyo kunye nabavelisi be-PCB kufuneka baxhotyiswe ngesakhono sokuvelisa esikwinqanaba eliphezulu kwaye babe nobuchule ekuziphatheni kakuhle. Njengomvelisi oneminyaka emininzi yamava omzekelo we-PCB kunye nezixhobo zokuvelisa eziphambili, i-YMS inokuba liqabane elifanelekileyo xa uqhuba iprojekthi ye-PCB. Emva kokubonelela zonke iifayile kwiimfuno zokwenziwa, unokufumana iibhodi zakho zeprototype ngeveki okanye ngaphantsi. Nceda uqhagamshelane nathi ukuze ufumane elona xabiso kunye nexesha lokuvelisa.