Extreme Copper PCB 2 Layer 10 0z Heavy Copper Board| YMS PCB
The construction of a heavy copper circuit endows a board with benefits such as:
- Increased endurance to thermal strains.
- Increased current carrying capacity.
- Increased mechanical strength at connector sites and in PTH holes.
- Use of exotic materials to their full potential without circuit failure.
- Reduced product size by incorporating multiple copper weights on the same layer of circuitry .
- Heavy copper plated vias carry higher current through the board and help to transfer heat to an external heatsink.
Kapaċità tal-manifattura tal-PCB tar-ram tqil YMS:
| Ħarsa ġenerali tal-kapaċitajiet tal-manifattura tal-PCB tar-ram tqil YMS | ||
| Karatteristika | kapaċitajiet | |
| Għadd ta 'Saffi | 1-30L | |
| bażi Materjal | FR-4 Standard Tg, FR4-mid Tg，FR4-High Tg | |
| Ħxuna | 0.6 mm - 8.0mm | |
| Piż massimu tar-ram tas-saff ta' barra (lest) | 15OZ | |
| Piż massimu tar-ram tas-saff ta' ġewwa (lest) | 30OZ | |
| Linja Minima Wisa 'u Spazju | 4oz Cu 8mil/8mil; 5oz Cu 10mil/10mil; 6oz Cu 12mil/12mil; 12oz Cu 18mil/28mil; 15oz Cu 30mil/38mil .eċċ. | |
| BGA PITCH | 0.8mm (32mil) | |
| Daqs Min Imtaqqab mekkaniku | 0.25mm (10mil) | |
| Proporzjon tal-Aspett għal toqba li tgħaddi | 16 ： 1 | |
| Finish tal-wiċċ | HASL, HASL mingħajr ċomb, ENIG, Landa tal-Immersjoni, OSP, Fidda tal-Immersjoni, Saba 'Deheb, Deheb iebes bl-Electroplating, OSP ective ENEPIG.etc Selettiv. | |
| Permezz tal-Għażla tal-Imla | Il-via hija miksija u mimlija b'epossi konduttivi jew mhux konduttivi imbagħad mgħottija u miksija (VIPPO) | |
| Ram mimli, mimli bil-fidda | ||
| Reġistrazzjoni | ± 4mil | |
| Maskra tal-Istann | Aħdar, Aħmar, Isfar, Blu, Abjad, Iswed, Vjola, Iswed Matte, aħdar Matte eċċ. | |
Tista 'Tħobb:
1、What are the precautions for heavy copper PCB wiring
2、What are the specifications of heavy copper PCB
3、What are the heavy copper PCB materials
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