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High Quality for Ceramic Insulation Board - 10Layer 2 Step HDI Board | YMS PCB – Yongmingsheng

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High Quality for Ceramic Insulation Board - 10Layer 2 Step HDI Board | YMS PCB – Yongmingsheng Detail:

HDI Structures:

1+N+1 – PCBs contain 1 “build-up” of high-density interconnection layers.

i+N+i (i≥2) – PCBs contain 2 or more “build-up” of high density interconnection layers. Microvias on different layers can be staggered or stacked. Copper filled stacked microvia structures are commonly seen in challenging designs.

Any Layer HDI – All the layers of a PCB are high density interconnection layers which allows the conductors on any layer of the PCB to be interconnected freely with copper filled stacked microvia structures (“any layer via”). This provides a reliable interconnect solution for highly complex large pin-count device


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  • We have been appreciated the Chinese manufacturing, this time also did not let us disappoint,good job!
    5 Stars By Martin Tesch from Israel - 2017.05.02 11:33
    Managers are visionary, they have the idea of "mutual benefits, continuous improvement and innovation", we have a pleasant conversation and Cooperation.
    5 Stars By Elva from Maldives - 2018.12.14 15:26
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